ADA4431-1YCPZ-R7 Analog Devices Inc, ADA4431-1YCPZ-R7 Datasheet - Page 5

• Manufacturer Part Number: ADA4431-1YCPZ-R7
• Description: Low Pwr Comp Video Fltr W/ULP Disable
• Manufacturer: Analog Devices Inc

Specifications of ADA4431-1YCPZ-R7

• Applications: Filter
• Output Type: Rail-to-Rail
• Number Of Circuits: 1
• -3db Bandwidth: 7.9MHz
• Current - Supply: 4.7mA
• Voltage - Supply, Single/dual (±): 2.5 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: 16-UFQFN, CSP Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADA4431-1YCPZ-R7TR

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
to a high thermal conductivity 2s2p circuit board, as described
in EIA/JESD 51-7. The exposed pad is not electrically connected to
the device. It is typically soldered to a pad on the PCB that is
thermally and electrically connected to an internal ground plane.
Table 4. Thermal Resistance
Package Type
16-lead LFCSP-UQ (CP-16-12)
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the ADA4431-1
package is limited by the associated rise in junction temperature
(T
transition temperature, the plastic changes its properties. Even
temporarily exceeding this temperature limit can change the
stresses that the package exerts on the die, permanently shifting
the parametric performance of the ADA4431-1. Exceeding a
junction temperature of 150°C for an extended period can result in
changes in the silicon devices potentially causing failure.
JA
J
) on the die. At approximately 150°C, which is the glass
is specified for the device (including exposed pad) soldered
θ
43
JA
Rating
4.0 V
See Figure 3
–65°C to +125°C
–40°C to +85°C
300°C
150°C
Unit
°C/W
Rev. 0 | Page 5 of 12
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the voltage
between the supply pins (V
The power dissipated due to the load drive depends upon the
particular application. The power due to load drive is calculated
by multiplying the load current by the associated voltage drop
across the device. RMS voltages and currents must be used in
these calculations.
Airflow increases heat dissipation, effectively reducing θ
addition, more metal directly in contact with the package leads
and exposed pad from metal traces, through-holes, ground, and
power planes reduces the θ
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 16-lead LFCSP
package (43°C/W) on a JEDEC standard 4-layer board.
ESD CAUTION
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
–40 –30 –20 –10
AMBIENT TEMPERATURE (°C)
0
10 20 30
JA
S
) times the quiescent current (I
.
40
D
50 60
) is the sum of the
70 80 90 100
ADA4431-1
JA
. In
S
).