ADA4691-2ACPZ-RL Analog Devices Inc, ADA4691-2ACPZ-RL Datasheet - Page 6

• Manufacturer Part Number: ADA4691-2ACPZ-RL
• Description: Dual W/SD LowPwr/Noise,Wideband, R-R
• Manufacturer: Analog Devices Inc

Specifications of ADA4691-2ACPZ-RL

• Amplifier Type: Voltage Feedback
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 1.3 V/µs
• Gain Bandwidth Product: 3.6MHz
• Current - Input Bias: 0.5pA
• Voltage - Input Offset: 500µV
• Current - Supply: 180µA
• Current - Output / Channel: 55mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 5.5 V, ±1.35 V ~ 2.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-LFCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADA4691-2/ADA4691-4/ADA4692-2/ADA4692-4
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Input Voltage
Input Current
Shutdown Pin Rise/Fall Times
Differential Input Voltage
Output Short-Circuit Duration to GND
Temperature
1
2
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
10 mA or less whenever the input signal exceeds the power supply rail by 0.3 V.
Input pins have clamp diodes to the supply pins. Limit the input current to
Differential input voltage is limited to 5 V or the supply voltage, whichever
is less.
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 60 sec)
1
2
Rating
6 V
V
±10 mA
50 μs maximum
±V
Indefinite
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
SS
SY
− 0.3 V to V
DD
+ 0.3 V
Rev. C | Page 6 of 20
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages and
measured using a standard 4-layer board, unless otherwise
specified.
Table 5. Thermal Resistance
Package Type
8-Lead SOIC_N (R-8)
8-Lead LFCSP (CP-8-6)
9-Ball WLCSP (CB-9-3)
10-Lead LFCSP (CP-10-11)
16-Lead LFCSP (CP-16-22)
14-Lead TSSOP (RU-14)
1
ESD CAUTION
N/A = not applicable.
JA
is specified for the worst-case conditions, that is, a device
θ
120
125
77
115
75
112
JA
θ
45
40
N/A
40
12
35
JC
1
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W