ADA4855-3YCPZ-RL Analog Devices Inc, ADA4855-3YCPZ-RL Datasheet - Page 5

• Manufacturer Part Number: ADA4855-3YCPZ-RL
• Description: Triple High Speed Extend Input Range RR
• Manufacturer: Analog Devices Inc

Specifications of ADA4855-3YCPZ-RL

• Amplifier Type: Voltage Feedback
• Number Of Circuits: 3
• Output Type: Rail-to-Rail
• Slew Rate: 870 V/µs
• -3db Bandwidth: 410MHz
• Current - Input Bias: 3.8µA
• Voltage - Input Offset: 1300µV
• Current - Supply: 7.8mA
• Current - Output / Channel: 57mA
• Voltage - Supply, Single/dual (±): 3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 16-LFCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Gain Bandwidth Product: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Internal Power Dissipation
Common-Mode Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
for a device soldered in a circuit board for surface-mount packages.
Table 4.
Package Type
16-Lead LFCSP
Specification is for device in free air.
JA
is specified for the worst-case conditions, that is, θ
1
θ
67
JA
Rating
6 V
See Figure 3
(−V
±V
Observe power curves
−65°C to +125°C
−40°C to +105°C
300°C
S
θ
17.5
S
− 0.2 V) to (+V
JC
JA
is specified
Unit
°C/W
S
− 1 V)
Rev. 0 | Page 5 of 20
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
ADA4855-3 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit may cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package. Exceeding a junction temperature of 175°C for
an extended period can result in device failure.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
ESD CAUTION
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0
AMBIENT TEMPERATURE (°C)
ADA4855-3