ADG1209YRZ-REEL7 Analog Devices Inc, ADG1209YRZ-REEL7 Datasheet - Page 18

• Manufacturer Part Number: ADG1209YRZ-REEL7
• Description: IC,ANALOG MUX,SINGLE,4-CHANNEL,CMOS,SOP,16PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: iCMOS®r

Specifications of ADG1209YRZ-REEL7

• Design Resources: Parametric Measurement Unit and Supporting Components for PAD Appls Using AD5522 and AD7685 (CN0104)
• Function: Multiplexer
• Circuit: 2 x 4:1
• On-state Resistance: 270 Ohm
• Voltage Supply Source: Single, Dual Supply
• Voltage - Supply, Single/dual (±): 10.8 V ~ 13.2 V, ±15 V
• Current - Supply: 1µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADG1208/ADG1209
ORDERING GUIDE
Model
ADG1208YRUZ
ADG1208YRUZ-REEL7
ADG1208YCPZ-REEL
ADG1208YCPZ-REEL7
ADG1208YRZ
ADG1208YRZ-REEL7
ADG1209YRUZ
ADG1209YRUZ-REEL7
ADG1209YCPZ-REEL
ADG1209YCPZ-REEL7
ADG1209YRZ
ADG1209YRZ-REEL7
1
Z = RoHS compliant part.
1
1
1
1
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
Rev. B | Page 18 of 20
Package Option
RU-16
RU-16
CP-16-4
CP-16-4
R-16
R-16
RU-16
RU-16
CP-16-4
CP-16-4
R-16
R-16