ADG1308BRZ Analog Devices Inc, ADG1308BRZ Datasheet - Page 14

• Manufacturer Part Number: ADG1308BRZ
• Description: IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,SOP,16PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Type: Analog Multiplexerr

Specifications of ADG1308BRZ

• Function: Multiplexer
• Circuit: 1 x 8:1
• On-state Resistance: 210 Ohm
• Current - Supply: 1µA
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Package: 16SOIC N
• Maximum On Resistance: 500@10.8V Ohm
• Maximum Propagation Delay Bus To Bus: 130@±15V|170@12V ns
• Maximum High Level Output Current: 30 mA
• Multiplexer Architecture: 8:1
• Maximum Turn-off Time: 130@12V ns
• Maximum Turn-on Time: 110@12V ns
• Power Supply Type: Single|Dual
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADG1308/ADG1309
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1308BRUZ
ADG1308BRUZ-REEL7
ADG1308BRZ
ADG1308BRZ-REEL7
ADG1309BRUZ
ADG1309BRUZ-REEL7
ADG1309BRZ
ADG1309BRZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
COPLANARITY
0.15
0.05
0.25 (0.0098)
0.10 (0.0039)
0.10
4.50
4.40
4.30
PIN 1
4.00 (0.1575)
3.80 (0.1496)
BSC
0.65
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
16
Figure 23. 16-Lead Thin Shrink Small Outline Package [TSSOP]
1
Figure 24. 16-Lead Standard Small Outline Package [SOIC_N]
COPLANARITY
16
1
COMPLIANT TO JEDEC STANDARDS MO-153-AB
1.27 (0.0500)
0.51 (0.0201)
0.31 (0.0122)
10.00 (0.3937)
5.10
5.00
4.90
COMPLIANT TO JEDEC STANDARDS MS-012-AC
9.80 (0.3858)
0.10
Dimensions shown in millimeters and (inches)
BSC
0.30
0.19
Dimensions shown in millimeters
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
9
8
1.20
MAX
Rev. A | Page 14 of 16
9
8
SEATING
PLANE
BSC
6.40
Narrow Body
6.20 (0.2441)
5.80 (0.2283)
(RU-16)
SEATING
PLANE
1.75 (0.0689)
1.35 (0.0531)
(R-16)
0.20
0.09
0.25 (0.0098)
0.17 (0.0067)
8°
0°
8°
0°
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.75
0.60
0.45
45°
Package Option
RU-16
RU-16
R-16
R-16
RU-16
RU-16
R-16
R-16