ADG658YCPZ Analog Devices Inc, ADG658YCPZ Datasheet - Page 20

• Manufacturer Part Number: ADG658YCPZ
• Description: 8:1 MUX, +/-5V Supply Rate To +125? I.C.
• Manufacturer: Analog Devices Inc
• Type: Analog Multiplexerr

Specifications of ADG658YCPZ

• Function: Multiplexer
• Circuit: 1 x 8:1
• On-state Resistance: 75 Ohm
• Voltage Supply Source: Single, Dual Supply
• Voltage - Supply, Single/dual (±): 2 V ~ 12 V, ±2 V ~ 6 V
• Current - Supply: 0.01µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-VQFN, CSP Exposed Pad
• Package: 16LFCSP EP
• Maximum On Resistance: 300@3.6V Ohm
• Maximum Propagation Delay Bus To Bus: 115@±5V|200@5V|370@3.6V ns
• Maximum High Level Output Current: 20 mA
• Multiplexer Architecture: 8:1
• Maximum Turn-off Time: 80@3.6V ns
• Maximum Turn-on Time: 370@3.6V ns
• Power Supply Type: Single|Dual
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADG658/ADG659
ORDERING GUIDE
Model
ADG658YRU
ADG658YRU-REEL7
ADG658YRUZ
ADG658YRUZ-REEL7
ADG658YCP
ADG658YCP-REEL7
ADG658YCPZ
ADG658YRQ
ADG658YRQ-REEL
ADG658YRQZ
ADG658YRQZ-REEL7
ADG659YRU
ADG659YRU-REEL7
ADG659YRUZ
ADG659YRUZ-REEL7
ADG659WYRUZ-REEL7
ADG659YCP
ADG659YCPZ
ADG659YCPZ-REEL7
ADG659YRQ
ADG659YRQ-REEL
ADG659YRQ-REEL7
ADG659YRQZ
1
2
©2004–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
Qualified for automotive.
1
1
1
1
1
1
1
1
1
1
1, 2
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
COPLANARITY
0.010
0.004
D03273-0-2/09(B)
0.065
0.049
0.004
Figure 34. 16-Lead Shrink Small Outline Package [QSOP]
16
1
PIN 1
0.025
BSC
COMPLIANT TO JEDEC STANDARDS MO-137AB
0.193
BSC
Dimensions shown in millimeters
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Shrink Small Outline Package [QSOP]
16-Lead Shrink Small Outline Package [QSOP]
0.012
0.008
Rev. B | Page 20 of 20
9
8
SEATING
PLANE
(RQ-16)
0.154
0.069
0.053
BSC
0.236
BSC
0.010
0.006
8°
0°
0.050
0.016
Package Option
RU-16
RU-16
RU-16
RU-16
CP-16
CP-16
CP-16
RQ-16
RQ-16
RQ-16
RQ-16
RU-16
RU-16
RU-16
RU-16
RU-16
CP-16
CP-16
CP-16
RQ-16
RQ-16
RQ-16
RQ-16