AM29F200BB-90EC Spansion Inc., AM29F200BB-90EC Datasheet - Page 41

Flash Memory IC

AM29F200BB-90EC

Manufacturer Part Number
AM29F200BB-90EC
Description
Flash Memory IC
Manufacturer
Spansion Inc.

Specifications of AM29F200BB-90EC

Memory Size
2Mbit
Memory Configuration
256K X 8
Ic Interface Type
Parallel
Access Time
90ns
Memory Case Style
TSOP
No. Of Pins
48
Operating Temperature Range
0°C To +70°C
Termination Type
SMD
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AM29F200BB-90EC
Manufacturer:
AMD
Quantity:
6 100
Part Number:
AM29F200BB-90EC
Manufacturer:
SPANSION
Quantity:
399
Part Number:
AM29F200BB-90EC
Manufacturer:
AMD
Quantity:
20 000
D A T A
S H E E T
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable ( i.e., submersible repeater and artificial satellite). Please note that FASL will not be liable to you
and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices
have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures
into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating condi-
tions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Ex-
change and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior
authorization by the respective government entity will be required for export of those products.
Trademarks
Copyright © 2006 Spansion Inc. All rights reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof, are
trademarks of Spansion Inc. Other company and product names used in this publication are for identification purposes only and may be trade-
marks of their respective companies.
Copyright © 1998–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
November 1, 2006 21526D4
Am29F200B
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