AMP02FSZ-RL Analog Devices Inc, AMP02FSZ-RL Datasheet - Page 11

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AMP02FSZ-RL

Manufacturer Part Number
AMP02FSZ-RL
Description
SOL-16 WITH TAPE & REEL
Manufacturer
Analog Devices Inc
Type
Instrumentation Ampr
Datasheet

Specifications of AMP02FSZ-RL

Amplifier Type
Instrumentation
Number Of Circuits
1
Slew Rate
6 V/µs
-3db Bandwidth
1.2MHz
Current - Input Bias
4nA
Voltage - Input Offset
40µV
Current - Supply
5mA
Current - Output / Channel
32mA
Voltage - Supply, Single/dual (±)
±4.5 V ~ 18 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.300", 7.5mm Width)
Number Of Channels
1
Number Of Elements
1
Power Supply Requirement
Dual
Common Mode Rejection Ratio
75dB
Voltage Gain Db
80dB
Input Resistance
16500@±15VMohm
Input Offset Voltage
0.2@±15VmV
Input Bias Current
0.02@±15VnA
Single Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (typ)
±5/±9/±12/±15V
Power Supply Rejection Ratio
75dB
Rail/rail I/o Type
No
Single Supply Voltage (min)
Not RequiredV
Single Supply Voltage (max)
Not RequiredV
Dual Supply Voltage (min)
±4.5V
Dual Supply Voltage (max)
±18V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Package Type
SOIC W
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
Gain Bandwidth Product
-
Lead Free Status / Rohs Status
Compliant
REV. E
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
(4.57)
0.180
MAX
8-Lead Plastic Dual-in-Line Package [PDIP]
Dimensions shown in inches and (millimeters)
1
8
COMPLIANT TO JEDEC STANDARDS MO-095AA
0.100 (2.54)
0.375 (9.53)
0.365 (9.27)
0.355 (9.02)
BSC
5
4
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
0.295 (7.49)
0.285 (7.24)
0.275 (6.98)
SEATING
PLANE
0.015
(0.38)
MIN
(N-8)
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.10
16-Lead Standard Small Outline Package [SOIC]
COMPLIANT TO JEDEC STANDARDS MS-013AA
16
1
Dimensions shown in millimeters and (inches)
1.27 (0.0500)
10.50 (0.4134)
10.10 (0.3976)
BSC
0.51 (0.0201)
0.33 (0.0130)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
OUTLINE DIMENSIONS
Wide Body
9
8
SEATING
PLANE
(R-16)
7.60 (0.2992)
7.40 (0.2913)
–11–
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
0.32 (0.0126)
0.23 (0.0091)
8-Lead Ceramic DIP - Glass Hermetic Seal [CERDIP]
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.200 (5.08)
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
PIN 1
MAX
0.005 (0.13)
Dimensions shown in inches and (millimeters)
8
0
MIN
0.75 (0.0295)
0.25 (0.0098)
0.405 (10.29) MAX
0.100 (2.54) BSC
8
1
0.070 (1.78)
0.030 (0.76)
1.27 (0.0500)
0.40 (0.0157)
0.055 (1.40)
MAX
5
4
45
0.060 (1.52)
0.015 (0.38)
0.310 (7.87)
0.220 (5.59)
(Q-8)
SEATING
PLANE
0.150 (3.81)
MIN
15
0
0.320 (8.13)
0.290 (7.37)
AMP02
0.015 (0.38)
0.008 (0.20)

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