CS47024C-DQZ Cirrus Logic Inc, CS47024C-DQZ Datasheet - Page 17

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CS47024C-DQZ

Manufacturer Part Number
CS47024C-DQZ
Description
IC 2CH ADC 4ch DAC & 32bit DSP
Manufacturer
Cirrus Logic Inc
Datasheet
5.4 Power Supply Characteristics
5.5 Thermal Data (100-Pin LQFP with Exposed Pad)
DS787PP1
Operational Power Supply Current:
VDD: Core and I/O operating
VDDA: PLL operating current
VDDA: DAC operating current (all 8 channels enabled)
VDDA: ADC operating current (all 4 channels enabled)
VDDIO: With most ports operating
Total Operational Power Dissipation:
Standby Power Supply Current:
VDD: Core and I/O not clocked
VDDA: PLLs halted
VDDA: DAC disabled
VDDA: ADC disabled
VDDIO: All connected I/O pins 3-stated by other ICs in system
Total Standby Power Dissipation:
Thermal Resistance (Junction to Ambient)
Thermal Resistance (Junction to Top of Package)
Note:
Note:
Note:
1. Dependent on application firmware and DSP clock speed.
1. To calculate the die temperature for a given power dissipation:
2. To calculate the case temperature for a given power dissipation:
Τ
Τ
Measurements performed under operating conditions)
j
Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20%
of the top & bottom layers.
Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20%
of the top & bottom layers and 0.5-oz. copper covering 90% of the internal power plane & ground plane layers.
c
= Ambient temperature + [ (Power Dissipation in Watts) *
=
Τ
j
- [ (Power Dissipation in Watts) * ψ
Parameter
1
Parameter
Four-layer Board
Four-layer Board
Two-layer Board
Two-layer Board
Copyright 2009 Cirrus Logic
jt
]
1
2
1
2
Symbol
θ
θ
ψ
ja
ja
jt
]
Min
-
-
-
-
Min
-
-
-
-
-
-
-
-
-
-
0.54
Typ
.28
34
18
1025
1745
Typ
325
410
215
Audio SOC Processor Family
16
56
34
27
26
40
24
Max
CS470xx Data Sheet
-
-
-
-
Max
-
-
-
-
-
-
-
-
-
-
°C / Watt
°C / Watt
Unit
Unit
mW
mA
mA
mA
mA
mA
μW
μA
μA
μA
μA
μA
17

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