CY7C1360C-166AXCT Cypress Semiconductor Corp, CY7C1360C-166AXCT Datasheet - Page 21
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CY7C1360C-166AXCT
Manufacturer Part Number
CY7C1360C-166AXCT
Description
CY7C1360C-166AXCT
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY7C1360C-200AJXC.pdf
(34 pages)
Specifications of CY7C1360C-166AXCT
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
9M (256K x 36)
Speed
166MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY7C1360C-166AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage temperature ................................ –65 °C to +150 °C
Ambient temperature with
power applied ........................................... –55 °C to +125 °C
Supply voltage on V
Supply voltage on V
DC voltage applied to outputs
in tri-state...........................................–0.5 V to V
DC input voltage .................................. –0.5 V to V
Current into outputs (LOW) ......................................... 20 mA
Static discharge voltage.......................................... > 2001 V
(per MIL-STD-883, method 3015)
Latch-up current ..................................................... > 200 mA
Operating Range
Electrical Characteristics
Over the Operating Range
Document Number: 38-05540 Rev. *K
Parameter
V
V
V
V
V
V
I
I
Notes
Commercial 0 °C to +70 °C
X
OZ
18. Overshoot: V
19. T
DD
DDQ
OH
OL
IH
IL
Industrial
Range
Power-up
: Assumes a linear ramp from 0 V to V
Power supply voltage
I/O supply voltage
Output HIGH voltage
Output LOW voltage
Input HIGH voltage
Input LOW voltage
Input leakage current
except ZZ and MODE
Input current of MODE
Input current of ZZ
Output leakage current
–40 °C to +85 °C
IH
Temperature
(AC) < V
Ambient
Description
DD
DDQ
DD
relative to GND ........–0.5 V to +4.6 V
relative to GND....... –0.5 V to +V
+ 1.5 V (Pulse width less than t
[18, 19]
[18]
[18]
3.3 V – 5 % /
+ 10%
V
DD
for 3.3 V I/O
for 2.5 V I/O
for 3.3 V I/O, I
for 2.5 V I/O, I
for 3.3 V I/O, I
for 2.5 V I/O, I
for 3.3 V I/O
for 2.5 V I/O
for 3.3 V I/O
for 2.5 V I/O
GND ≤ V
Input = V
Input = V
Input = V
Input = V
GND ≤ V
DD
(min) within 200 ms. During this time V
2.5 V – 5% to
I
SS
DD
SS
DD
I
DDQ
CYC
≤ V
≤ V
DD
V
V
/2), undershoot: V
DDQ
DDQ,
DDQ
+ 0.5 V
+ 0.5 V
OH
OH
OL
OL
DD
= 8.0 mA
= 1.0 mA
= –4.0 mA
= –1.0 mA
DD
output disabled
Test Conditions
IL
(AC) > –2 V (Pulse width less than t
Neutron Soft Error Immunity
LSBU
LMBU
SEL
* No LMBU or SEL events occurred during testing; this column represents a
statistical χ
Application Note AN54908
of Terrestrial Failure Rates”
Parameter
IH
< V
DD
2
, 95% confidence limit calculation. For more details refer to
and V
Description
Single event
single-bit
DDQ
latch-up
multi-bit
Logical
Logical
upsets
upsets
< V
CY7C1360C, CY7C1362C
“Accelerated Neutron SER Testing and Calculation
DD
.
CYC
Conditions
/2).
3.135
3.135
2.375
–0.3
–0.3
Min
–30
25 °C
25 °C
85 °C
2.4
2.0
2.0
1.7
–5
–5
–5
Test
–
–
–
–
V
V
DD
DD
Typ Max* Unit
361
2.625
0
0
Max
V
3.6
0.4
0.4
0.8
0.7
+ 0.3 V
+ 0.3 V
30
–
–
5
–
5
–
5
DD
Page 21 of 34
0.01
394
0.1
Unit
μA
μA
μA
μA
μA
μA
V
V
V
V
V
V
V
V
V
V
V
FIT/
FIT/
FIT/
Dev
Mb
Mb
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