DSPIC33FJ16GP101-E/P Microchip Technology, DSPIC33FJ16GP101-E/P Datasheet - Page 23
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DSPIC33FJ16GP101-E/P
Manufacturer Part Number
DSPIC33FJ16GP101-E/P
Description
16-bit DSC Family, 16 MIPS, 16KB Flash, 1KB RAM 18 PDIP .300in TUBE
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ16GP101-IP.pdf
(322 pages)
Specifications of DSPIC33FJ16GP101-E/P
Processor Series
dsPIC33F
Core
dsPIC
Data Bus Width
16 bit
Program Memory Type
Flash
Program Memory Size
16 KB
Interface Type
SPI, I2C, UART, JTAG
Number Of Programmable I/os
35
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 125 C
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
Core Processor
dsPIC
Core Size
16-Bit
Speed
16 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
13
Eeprom Size
-
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
18-DIP (0.300", 7.62mm)
A/d Bit Size
10 bit
A/d Channels Available
13
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ16GP101-E/P
Manufacturer:
MICROCHIP
Quantity:
12 000
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2.5
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging pur-
poses. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternately, refer to the AC/DC characteristics and tim-
ing requirements information in the “Flash Program-
ming Specification for dsPIC33F Families with Volatile
Configuration Bits” for information on capacitive load-
ing limits and pin input voltage high (V
(V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
ICE™.
For more information on ICD 2, ICD 3, and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip web
site.
• “MPLAB
• “Using MPLAB
• “MPLAB
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
© 2011 Microchip Technology Inc.
IL
Guide” (DS51331)
User’s Guide” (DS51616)
dsPIC33FJ16GP101/102 AND dsPIC33FJ16MC101/102
) requirements.
®
ICSP Pins
ICD 2, MPLAB ICD 3, or MPLAB REAL
®
®
®
®
ICD 2 In-Circuit Debugger User’s
ICD 2 Design Advisory” (DS51566)
ICD 3 Design Advisory” (DS51764)
REAL ICE™ In-Circuit Debugger
®
®
®
REAL ICE™” (poster) (DS51749)
ICD 2” (poster) (DS51265)
ICD 3” (poster) (DS51765)
IH
) and input low
Preliminary
2.6
Many DSCs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to
Configuration”
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in
FIGURE 2-3:
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
External Oscillator Pins
for details).
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
Figure
Section 8.0 “Oscillator
DS70652C-page 23
2-3.
13
14
15
16
17
18
19
20
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