DSPIC33FJ64GP710A-E/PT Microchip Technology, DSPIC33FJ64GP710A-E/PT Datasheet - Page 321
DSPIC33FJ64GP710A-E/PT
Manufacturer Part Number
DSPIC33FJ64GP710A-E/PT
Description
16 Bit MCU/DSP 40MIPS 64KB FLASH 100 TQFP 12x12x1mm TRAY
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ64GP206A-IMR.pdf
(338 pages)
Specifications of DSPIC33FJ64GP710A-E/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-TFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ64GP710A-E/PT
Manufacturer:
Microchip
Quantity:
243
Company:
Part Number:
DSPIC33FJ64GP710A-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- Current page: 321 of 338
- Download datasheet (3Mb)
2009 Microchip Technology Inc.
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
dsPIC33FJXXXGPX06A/X08A/X10A
1 2 3
D
D1
L
Dimension Limits
Preliminary
E1
NOTE 2
φ
Units
D1
A2
A1
L1
E1
N
A
E
D
e
L
φ
c
b
α
β
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
MILLIMETERS
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.50 BSC
1.00 REF
L1
NOM
1.00
0.60
0.22
3.5°
12°
12°
64
–
–
–
Microchip Technology Drawing C04-085B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
DS70593B-page 321
α
A2
Related parts for DSPIC33FJ64GP710A-E/PT
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet:
Part Number:
Description:
Manufacturer:
Microchip Technology Inc.
Datasheet: