NUF9002FCT1 ON Semiconductor, NUF9002FCT1 Datasheet

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NUF9002FCT1

Manufacturer Part Number
NUF9002FCT1
Description
IC FILTER 10CH EMI ESD 25FLPCHIP
Manufacturer
ON Semiconductor
Datasheet

Specifications of NUF9002FCT1

Resistance (ohms)
100
Capacitance
28pF
Power (watts)
0.2W, 1/5W
Package / Case
25-FlipChip
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Tolerance
-
NUF9002FC
Low Capacitance 10 Line
EMI Filter with ESD
Protection
Greater than −25 dB attenuation is obtained at frequencies from
900 MHz to 3.0 GHz. ESD protection is provided across all
capacitors.
Features
Benefits
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 1
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ESD Discharge
Steady−State Power per Resistor
Steady−State Power per Package
Operating Temperature Range
Storage Temperature Range
Junction Temperature
This device is a ten−line EMI filter array for wireless applications.
Filter Response
EMI Filtering and ESD Protection
Integration of 50 Discretes
Provides Protection for IEC61000−4−2 (Level 4)
Flip−Chip Package
Moisture Sensitivity Level 1
ESD Rating: Machine Model = C; Human Body Model = 3B
Pb−Free Package is Available*
Reduces EMI/RFI Emissions on a Data Line
Integrated Solution Offers Cost and Space Savings
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Integrated Solution Improves System Reliability
LCD for Cell Phones and PDAs
Computers and Printers
Communication Systems
MP3 Players
IEC61000−4−2
8.0 kV (Contact)
Rating
(T
Contact Discharge
A
= 25°C unless otherwise noted)
Symbol
T
V
T
P
P
STG
T
OP
PP
R
T
J
−55 to +150
−40 to +85
Value
+125
100
200
8.0
1
Unit
mW
mW
kV
°C
°C
°C
†For information on tape and reel specifications,
NUF9002FCT1
NUF9002FCT1G
INPUT
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
E
D
C
B
A
Device
A1
(Note: Microdot may be in either location)
GND
IN6
IN1
O1
O6
1
ORDERING INFORMATION
NUF9002 = Specific Device Code
A
Y
WW
G
CASE 499G
PIN CONFIGURATION
Flip−Chip
http://onsemi.com
LOW−PASS FILTER
GND
IN7
IN2
O2
O7
2
C
R
input
= Pb−Free Package
(Ball Side)
(Pb−Free)
I/O
Flip−Chip
Flip−Chip
= Assembly Location
= Year
= Work Week
Package
= 100 W
GND
= 28 pF
IN8
IN3
O3
O8
3
Publication Order Number:
MARKING DIAGRAM
Ç Ç
Ç Ç
GND
IN9
IN4
O4
O9
NUF9002
4
AYWWG
3000 Tape & Reel
3000 Tape & Reel
G
Shipping
NUF9002FC/D
IN10
O10
GND
IN5
O5
5
OUTPUT

Related parts for NUF9002FCT1

NUF9002FCT1 Summary of contents

Page 1

... OP T −55 to +150 °C STG T +125 °C J NUF9002FCT1 NUF9002FCT1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 http://onsemi.com LOW−PASS FILTER OUTPUT R = 100 W I/O ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Series Resistance Capacitance C Cut−Off Frequency 0 −5 −10 −15 −20 −25 Channel −30 −35 −40 Channel and 8 −45 1.E+06 1.E+07 ...

Page 3

PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter PCB Pad Size Pad Shape Pad Type Solder Mask Opening Solder Stencil Thickness Stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width 300 or 350 mm Solder Ball No Clean Type 3 ...

Page 4

... American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. ...

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