HFBR-1522ETZ Avago Technologies US Inc., HFBR-1522ETZ Datasheet - Page 4

FIBER OPTIC TRANSMITTER 660NM

HFBR-1522ETZ

Manufacturer Part Number
HFBR-1522ETZ
Description
FIBER OPTIC TRANSMITTER 660NM
Manufacturer
Avago Technologies US Inc.
Series
Versatile Linkr
Datasheet

Specifications of HFBR-1522ETZ

Wavelength
660nm
Voltage - Forward (vf) Typ
1.67V
Current - Dc Forward (if)
60mA
Voltage - Dc Reverse (vr) (max)
5V
Capacitance
86pF
Connector Type
Versatile Link
Maximum Forward Current
80 mA
Maximum Power Dissipation
40 mW
Operating Voltage
7 V
Transmission Distance
43 m
Product
Transmitter
Data Rate
1 MBd
Diode Capacitance
86 pF
Maximum Rise Time
20 ns
Maximum Fall Time
20 ns
Pulse Width Distortion
40 ns
Maximum Output Current
250 uA
Operating Supply Voltage
7 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Forward Current If
60mA
Forward Voltage
1.67V
Reverse Voltage Vr
5V
Data Transmission Distance
43m
Wavelength Typ
660nm
Peak Reflow Compatible (260 C)
Yes
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Spectral Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
516-2304-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HFBR-1522ETZ
Manufacturer:
AVAGO
Quantity:
330
Versatile Link Printed Board Layout Dimensions
Horizontal Module
Interlocked (Stacked) Assemblies
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the inter -
locking mechanism by sliding the L bracket body from
above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked
units into uniform alignment. This tech nique prevents
potential harm that could occur to fingers and hands of
assemblers from the package pins. Stacked horizontal
Stacking Horizontal Modules
Figure 1. Interlocked (stacked) horizontal or vertical packages
4
TOP VIEW
(0.100)
2.54
DIMENSIONS IN MILLIMETERS (INCHES).
4
5
3 2
1
8
(0.300)
7.62
(0.073)
1.85
1.01 (0.040) DIA.
(0.300)
MIN.
7.62
PCB EDGE
(refer to Figure 1)
Vertical Module
packages can be disengaged if necessary. Repeated
stacking and unstack ing causes no damage to individual
units.
To stack vertical packages, hold one unit in each hand,
with the pins facing away and the optical ports on the
bottom. Slide the L bracket unit into the L slot unit. The
straight edge used for horizontal package alignment is
not needed.
Stacking Vertical Modules

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