CYONS2100-LBXC Cypress Semiconductor Corp, CYONS2100-LBXC Datasheet - Page 27

• Manufacturer Part Number: CYONS2100-LBXC
• Description: IC SENSOR LASER OVATION 42-QFN
• Manufacturer: Cypress Semiconductor Corp

Specifications of CYONS2100-LBXC

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Thermal Impedances
Table 22. Thermal Impedances per Package
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 23. Solder Reflow Peak Temperature
Document Number: 001-44046 Rev. *A
Notes
11. T
12. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.
13. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications.
J
= T
A
+ Power x θ
42 PQFN
Package
JA
.
42 PQFN
Package
[12]
Minimum Peak Temperature
ADVANCE
240°C
[13]
Typical θ
Maximum Peak Temperature
46 °C/W
JA
[11]
260°C
CYONS2100
Page 27 of 33
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