MM01057 Multicore, MM01057 Datasheet

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MM01057

Manufacturer Part Number
MM01057
Description
63/37 CRYSL 400 2% .064DIA/16SWG
Manufacturer
Multicore
Series
C400™r
Type
Wire Solderr
Datasheet
1.MM00978.pdf (2 pages)

Specifications of MM01057

Process
Leaded
Flux Type
No-Clean
Wire Gauge
16
Core Size
2%
Form
Spool, 454g (1 lb)
Composition
Sn63Pb37 (63/37)
Diameter
0.064" (1.63mm)
Melting Point
361°F (183°C)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
392249
82-113
PRODUCT DESCRIPTION
C400™ provides the following product characteristics:
C400™ cored solder wire has been specially formulated to
complement no clean wave and reflow soldering processes.
C400™ wires provide fast soldering on copper, brass, and
solder coated materials.
TYPICAL PROPERTIES
Solder Cored Wire
ALLOYS:
The alloys used in C400™ cored solder wires conform to the
purity requirements of the common national and international
standards.
FLUX:
C400™ solid flux is based on modified rosin and carefully
selected activators. In practice they exhibit a mild rosin odor
and leave a small quantity of clear residue.
DIRECTIONS FOR USE
Soldering with C400™ does not require any special methods
or deviation from standard hand soldering practices.
Alloys - Tin/lead
Alloys - Lead Free
Acid Value
Halide content
Flux Content (%)
Technology
Product Benefits
IPC/J-STD-004
Classification
Application
Surface Finishes
205 to 220 mg KOH/g
Zero
2.2
Cored solder wire
ROL0
Soldering - Cored wire
Copper, Brass and Nickel
• SN63
• SN60
• SN62
• 97SC (SAC305)
• 96SC (SAC387)
• 99C (SnCu)
• 95A (SnSb)
• 96S (SnAg)
• Halide free
• No clean
• Clear residue
• Good wetting
• Fast soldering
• Heat stable
• Mild odor
• Pb-free and SnPb alloys available
Soldering Iron:
Soldering Process:
Cleaning:
C400™ flux cored solder wire has been formulated to leave
amber flux residues and resist spitting and fuming. In most
industrial and consumer electronics applications, cleaning will
not be required. The product may, therefore, be used to
complement a no-clean wave soldering or reflow process or to
allow repairs to cleaned boards without the need for a second
cleaning process. In high-reliability applications, the residues
should be removed.
Should cleaning be required, this is best achieved using
SC-01™ cleaner.
1. Apply the soldering iron tip to the work surface. The iron
2. Apply C400™ flux cored wire to a part of the joint surface
3. Remove solder from the work piece and then remove the
4. The total process will be very rapid, depending upon
5. The resin and flux systems are designed to leave
● Good results can be obtained using a range of tip
● Care should be exercised to avoid unnecessarily high tip
● A high tip temperature may increase any tendency to flux
● The tip of the soldering iron should be properly tinned.
● Wipe the tip on a clean, damp sponge before re-tinning
temperatures. However, the optimum tip temperature and
heat capacity required for a hand-soldering process is a
function of both soldering iron design and the nature of
the task.
temperatures for extensive periods of time.
spitting and it may produce some residue darkening.
Severely contaminated soldering iron tips should be
cleaned with Multicore® Tip Tinner/Cleaner.
with C400™ wire.
tip should contact both the base material and the lead at
the same time to heat both surfaces properly. It should
take no more than a fraction of a second to heat both
surfaces adequately.
away from the soldering iron and allow to form a joint
fillet. This will be virtually instantaneous. Do not apply
excessive solder to the joint as this will not improve joint
integrity and it will leave excess flux residues on the
surface.
iron tip.
thermal mass, tip temperature, tip configuration and the
solderability of the surfaces to be joined.
relatively low residues and to minimize residual activity.
This is achieved by ensuring some decomposition and
volatilization takes place during the soldering process
Technical Data Sheet
C400™
October-2009

MM01057 Summary of contents

Page 1

... The tip of the soldering iron should be properly tinned. Severely contaminated soldering iron tips should be cleaned with Multicore® Tip Tinner/Cleaner. ● Wipe the tip on a clean, damp sponge before re-tinning with C400™ wire. ...

Page 2

... RELIABILITY PROPERTIES J-STD-004 Solder spread mm² Corrosion Test SIR (without cleaning) IPC-SF-818 Class 3 Bellcore TR-NWT-000078 Electromigration (without cleaning) Bellcore TR-NWT-000078 Classification EN29454-1 IPC-SF-818 PACKAGING C400™ is available in various diameters, flux percentages, and reel sizes. DATA RANGES The data contained herein may be reported as a typical value and/or a range ...