MBRP30045CT ON Semiconductor, MBRP30045CT Datasheet

MBRP30045CT

Manufacturer Part Number

MBRP30045CT

Description

Schottky (Diodes & Rectifiers) 300A 45V

Manufacturer

ON Semiconductor

Datasheet

1.MBRP30045CT.pdf (4 pages)

Specifications of MBRP30045CT

Product

Schottky Diodes

Peak Reverse Voltage

45 V

Forward Continuous Current

300 A

Max Surge Current

2500 A

Configuration

Dual Common Cathode

Forward Voltage Drop

0.82 V

Maximum Reverse Leakage Current

800 uA

Operating Temperature Range

- 55 C to + 150 C

Mounting Style

Screw

Package / Case

POWER TAP II

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MBRP30045CT

Manufacturer:

MOTOROLA

Quantity:

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MBRP30045CT

Manufacturer:

MOTOROLA

Quantity:

300

Company:

H&T Electronics

Part Number:

MBRP30045CT

Quantity:

100

Current page: 1 of 4
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MBRP30045CT

POWERTAPt II

SWITCHMODEt

Power Rectifier

with a platinum barrier metal.

Features

•

Mechanical Characteristics:

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

*For additional information on our Pb−Free strategy and soldering details, please

MAXIMUM RATINGS

September, 2006 − Rev. 6

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

Average Rectified Forward Current

(Rated V

Peak Repetitive Forward Current,

(Rated V

20 kHz, T

Non−Repetitive Peak Surge Current

(Surge Applied at Rated Load Conditions

Halfwave, Single Phase, 60 Hz) Per Leg

Peak Repetitive Reverse Current

(2.0 ms, 1.0 kHz)

Storage Temperature Range

Operating Junction Temperature

Voltage Rate of Change (Rated V

These state−of−the−art devices use the Schottky Barrier principle

Output

See procedure given in the Package Outline Section

Dual Diode Construction − May Be Paralleled for Higher Current

Guardring for Stress Protection

Low Forward Voltage

150°C Operating Junction Temperature

Guaranteed Reverse Avalanche

Pb−Free Package is Available*

Case: Epoxy, Molded with metal heatsink base

Weight: 80 grams (approximately)

Finish: All External Surfaces Corrosion Resistant

Top Terminal Torque: 25−40 lb−in max

Base Plate Torques:

, T

, Square Wave,

= 140°C)

Rating

Preferred Device

Per Device

Per Leg

)

Symbol

dv/dt

F(AV)

RRM

FRM

FSM

RWM

RRM

stg

−55 to +150

10,000

2500

Max

150

300

2.0

V/ms

Unit

°C

MBRP30045CT

MBRP30045CTG

Preferred devices are recommended choices for future use

and best overall value.

Device

300 AMPERES, 45 VOLTS

B30045T = Specific Device Code

MCC

BARRIER RECTIFIER

ORDERING INFORMATION

AYYWWG

MCC

MARKING DIAGRAM

http://onsemi.com

SCHOTTKY

= Mold Compound Code

= Assembly Location

= Year

= Work Week

= Pb−Free Package

POWERTAP II

(Pb−Free)

Package

Publication Order Number:

POWERTAP II

CASE 357C

PLASTIC

B30045T

MBRP30045CT/D

25 Units/Tray

Shipping

Related parts for MBRP30045CT

MBRP30045CT Summary of contents

Page 1

... POWERTAP II 3 CASE 357C PLASTIC MARKING DIAGRAM MCC B30045T AYYWWG B30045T = Specific Device Code MCC = Mold Compound Code A = Assembly Location YY = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION Device Package Shipping POWERTAP II 25 Units/Tray POWERTAP II 25 Units/Tray (Pb−Free) Publication Order Number: MBRP30045CT/D ...

Page 2

THERMAL CHARACTERISTICS (Per Leg) Rating Thermal Resistance, Junction−to−Case ELECTRICAL CHARACTERISTICS Instantaneous Forward Voltage (Note 150 Amps 25° 300 Amps 25° Instantaneous Reverse Current (Note 1) (Rated dc ...

Page 3

The POWERTAP package requires special mounting considerations because of the long longitudinal axis of the copper heat sink important to follow the proper tightening sequence to avoid warping the heat sink, which can reduce thermal contact between the ...

Page 4

... Q 0.270 0.285 6.86 7.23 R 31.50 BSC 80.01 BSC U 0.600 0.630 15.24 16.00 V 0.330 0.375 8.39 9.52 W 0.170 0.190 4.32 4.82 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MBRP30045CT/D ...

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