BAS70-04W,115 NXP Semiconductors, BAS70-04W,115 Datasheet - Page 13
![DIODE SCHOTTKY 70V 70MA SOT323](/photos/5/24/52427/568-umt3_sot-323_sc-70_sot323_sml.jpg)
BAS70-04W,115
Manufacturer Part Number
BAS70-04W,115
Description
DIODE SCHOTTKY 70V 70MA SOT323
Manufacturer
NXP Semiconductors
Datasheet
1.BAS70-04215.pdf
(20 pages)
Specifications of BAS70-04W,115
Package / Case
SC-70-3, SOT-323-3
Voltage - Forward (vf) (max) @ If
1V @ 15mA
Current - Reverse Leakage @ Vr
10µA @ 70V
Current - Average Rectified (io) (per Diode)
70mA (DC)
Voltage - Dc Reverse (vr) (max)
70V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
1 Pair Series Connection
Mounting Type
Surface Mount
Product
Schottky Diodes
Peak Reverse Voltage
70 V
Forward Continuous Current
0.07 A
Max Surge Current
0.1 A
Configuration
Dual Series
Forward Voltage Drop
1 V @ 0.015 A
Maximum Reverse Leakage Current
10 uA
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Rectifier Type
Schottky Diode
Peak Rep Rev Volt
70V
Avg. Forward Curr (max)
0.07A
Rev Curr
10uA
Peak Non-repetitive Surge Current (max)
0.1A
Forward Voltage
1V
Operating Temp Range
-65C to 150C
Package Type
SC-70
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Dc
08+
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-3408-2
934034480115
BAS70-04W T/R
934034480115
BAS70-04W T/R
NXP Semiconductors
BAS70_1PS7XSB70_SER_9
Product data sheet
Fig 19. Reflow soldering footprint SOD123F
Fig 20. Reflow soldering footprint SOD882
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.6
R = 0.05 (8×)
solder lands
solder resist
occupied area
solder paste
BAS70 series; 1PS7xSB70 series
(2×)
1.1
Rev. 09 — 13 January 2010
0.90
4.4
2.9
1.6
4
0.30
0.40
0.50
(2×)
(2×)
(2×)
0.30
1.30
1.1 1.2
General-purpose Schottky diodes
R = 0.05 (8×)
0.60
(2×)
0.70
(2×)
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
mbl872
0.80
(2×)
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