TISP6NTP2CD-S Bourns Inc., TISP6NTP2CD-S Datasheet - Page 8

• Manufacturer Part Number: TISP6NTP2CD-S
• Description: Sidacs Quad Buffered PGate Forward Conducting
• Manufacturer: Bourns Inc.

Specifications of TISP6NTP2CD-S

• Breakover Current Ibo Max: 7 A
• Rated Repetitive Off-state Voltage Vdrm: 170 V
• Off-state Leakage Current @ Vdrm Idrm: 0.005 mA
• Mounting Style: SMD/SMT
• Package / Case: SO-8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
NOTES: A. Leads are within 0.25 (0.010) radius of true position at maximum material condition.
JUNE 1998 - REVISED OCTOBER 2000
Specifications are subject to change without notice.
D008 Plastic Small-outline Package
D008
DIMENSIONS ARE:
(0.053 - 0.069)
(0.228 - 0.244)
5.80 - 6.20
1.35 - 1.75
TISP6NTP2A Programmable Protector
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0.15 (0.006).
D. Lead tips to be planar within ±0.051 (0.002).
(0.150 - 0.157)
(0.004 - 0.008)
0.102 - 0.203
3.81 - 4.00
(0.011 - 0.031)
(INCHES)
METRIC
0.28 - 0.79
INDEX
1
8
7 ° NOM
3 Places
2
(0.189 - 0.197)
7
4.80 - 5.00
(see Note A)
Pin Spacing
6 places
(0.050)
1.27
6
3
MECHANICAL DATA
(0.014 - 0.020)
0.36 - 0.51
(0.010 - 0.020)
5
4
8 Places
0.25 - 0.50
x 45 ° N0M
(0.0075 - 0.0090)
0.190 - 0.229
8-pin Small Outline Microelectronic Standard
Package MS-012, JEDEC Publication 95
7 ° NOM
4 Places
(0.181 - 0.205)
4.60 - 5.21
(0.020 - 0.044)
0.51 - 1.12
4 ° ± 4 °
MDXXAAC
227