LT1172MJ8 Linear Technology, LT1172MJ8 Datasheet - Page 17

• Manufacturer Part Number: LT1172MJ8
• Description: SP-SWREG/Monolithic, 100kHz 5A 2.5A And 1.25A High Efficiency Switching Regulato
• Manufacturer: Linear Technology

PACKAGE DESCRIPTIO
(1.524)
.060
HATCHED AREA IS SOLDER PLATED
NOTE:
1. DIMENSIONS ARE
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
BOTTOM VIEW OF DD PAK
COPPER HEAT SINK
(7.620 – 8.255)
(0.229 – 0.381)
8.255
.300 – .325
.009 – .015
.325
(6.502)
(7.620)
.256
.300
+.035
–.015
+0.889
–0.381
MILLIMETERS
INCHES
(1.524)
(1.905)
.075
.060
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN INCH/(MILLIMETER)
2. DRAWING NOT TO SCALE
(4.648)
.183
.067
(1.651)
.065
TYP
U
.420
(1.524)
.060
TYP
(8.382 – 9.398)
3.632
.330 – .370
.143
(2.54)
.100
BSC
(1.143 – 1.651)
+0.305
–0.508
+.012
–.020
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
.045 – .065
(Reference LTC DWG # 05-08-1461)
.042
5-Lead Plastic DD Pak
.090
.350
N8 Package
.565
Q Package
(0.711 – 0.965)
.028 – .038
(0.457 0.076)
TYP
.018 .003
.080
(9.906 – 10.541)
(3.302 0.127)
FOR THICKER SOLDER PASTE APPLICATIONS
.205
.130 .005
(3.175)
.390 – .415
.320
(1.702)
.125
MIN
RECOMMENDED SOLDER PAD LAYOUT
.067
BSC
15 TYP
(0.508)
.020
MIN
.067
.420
.276
(4.191 – 4.572)
(6.477 0.381)
.165 – .180
.255 .015*
(0.330 – 0.584)
.013 – .023
LT1 170/LT1 171/LT1172
(1.499)
.059
TYP
.042
.090
.325
.565
8
1
2
(10.160)
7
(1.143 – 1.397)
MAX
0.102
.400*
(2.413 – 2.921)
.045 – .055
.004
(1.270 0.305)
.095 – .115
.050 .012
6
3
+0.203
–0.102
+.008
–.004
Q(DD5) 0502
N8 0502
5
4
17
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