LTC3780EG Linear Technology, LTC3780EG Datasheet - Page 27

• Manufacturer Part Number: LTC3780EG
• Description: IC,SMPS CONTROLLER,CURRENT-MODE,CMOS,SSOP,24PIN,PLASTIC
• Manufacturer: Linear Technology

PACKAGE DESCRIPTIO
5.50 ±0.05
4.10 ±0.05
3.45 ±0.05
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
RECOMMENDED SOLDER PAD LAYOUT
PIN 1
TOP MARK
(NOTE 6)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5.00 ± 0.10
(4 SIDES)
U
0.50 BSC
0.25 ± 0.05
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693)
0.70 ±0.05
PACKAGE
OUTLINE
UH Package
0.75 ± 0.05
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
3.45 ± 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
31
0.50 BSC
0.25 ± 0.05
32
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 × 45° CHAMFER
LTC3780
1
2
(UH32) QFN 1004
0.40 ± 0.10
27
3780f