BAV99,215 NXP Semiconductors, BAV99,215 Datasheet - Page 3

DIODE SW DBL 75V 215MA HS SOT23

BAV99,215

Manufacturer Part Number
BAV99,215
Description
DIODE SW DBL 75V 215MA HS SOT23
Manufacturer
NXP Semiconductors
Datasheets

Specifications of BAV99,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Current - Reverse Leakage @ Vr
500nA @ 80V
Current - Average Rectified (io) (per Diode)
215mA (DC)
Voltage - Dc Reverse (vr) (max)
100V
Reverse Recovery Time (trr)
4ns
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Series Connection
Mounting Type
Surface Mount
Product
Switching Diodes
Peak Reverse Voltage
100 V
Forward Continuous Current
0.215 A
Max Surge Current
4 A
Configuration
Dual Series
Recovery Time
4 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
0.5 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Rectifier Type
Switching Diode
Peak Rep Rev Volt
100V
Avg. Forward Curr (max)
0.215A
Rev Curr
0.5uA
Peak Non-repetitive Surge Current (max)
4A
Forward Voltage
1.25V
Operating Temp Range
-65C to 150C
Package Type
TO-236AB
Rev Recov Time
4ns
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1624-2
933215370215
BAV99 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAV99,215
Manufacturer:
NXP Semiconductors
Quantity:
4 800
Part Number:
BAV99,215
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
BAV99,215
Quantity:
10 000
NXP Semiconductors
5. Limiting values
BAV99_SER
Product data sheet
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
Symbol
Per diode
V
V
I
I
I
P
T
T
Per device
T
F
FRM
FSM
j
amb
stg
RRM
R
tot
Single diode loaded.
Double diode loaded.
T
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Soldering points at pins 2, 3, 5 and 6.
j
= 25 °C prior to surge.
Limiting values
Parameter
repetitive peak reverse
voltage
reverse voltage
forward current
repetitive peak forward
current
non-repetitive peak
forward current
total power dissipation
junction temperature
ambient temperature
storage temperature
BAV99
BAV99S
BAV99W
BAV99
BAV99S
BAV99W
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 18 November 2010
Conditions
square wave
T
T
T
amb
sp
amb
t
t
t
p
p
p
≤ 85 °C
= 1 μs
= 1 ms
= 1 s
≤ 25 °C
≤ 25 °C
[1][4]
High-speed switching diodes
[1]
[2]
[1]
[1]
[2]
[3]
[5]
BAV99 series
Min
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
−65
−65
© NXP B.V. 2010. All rights reserved.
Max
100
100
215
125
200
150
130
500
4
1
0.5
250
250
200
150
+150
+150
Unit
V
V
mA
mA
mA
mA
mA
mA
A
A
A
mW
mW
mW
°C
°C
°C
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