BAS40-06,215 NXP Semiconductors, BAS40-06,215 Datasheet - Page 12

• Manufacturer Part Number: BAS40-06,215
• Description: DIODE SCHOTTKY 40V 120MA SOT-23
• Manufacturer: NXP Semiconductors

Specifications of BAS40-06,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Mounting Type: Surface Mount
• Speed: Small Signal =< 200mA (Io), Any Speed
• Current - Reverse Leakage @ Vr: 10µA @ 40V
• Voltage - Forward (vf) (max) @ If: 1V @ 40mA
• Voltage - Dc Reverse (vr) (max): 40V
• Current - Average Rectified (io) (per Diode): 120mA (DC)
• Diode Configuration: 1 Pair Common Anode
• Product: Schottky Diodes
• Peak Reverse Voltage: 40 V
• Forward Continuous Current: 0.12 A
• Max Surge Current: 0.2 A
• Configuration: Dual Common Anode
• Forward Voltage Drop: 1 V @ 0.04 A
• Maximum Reverse Leakage Current: 10 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 934034550215::BAS40-06 T/R::BAS40-06 T/R

NXP Semiconductors
10. Soldering
BAS40_1PSXXSB4X_SER_8
Product data sheet
Fig 15. Reflow soldering footprint SOD323 (SC-76)
Fig 16. Wave soldering footprint SOD323 (SC-76)
Fig 17. Reflow soldering footprint SOD523 (SC-79)
Dimensions in mm
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
2.75
0.95
1.20
BAS40 series; 1PSxxSB4x series
Rev. 08 — 13 January 2010
0.50
(2×)
preferred transport direction during soldering
solder lands
solder resist
occupied area
solder paste
3.05
2.80
2.10
1.60
1.20
5.00
4.40
1.40
0.50
msa433
1.80
1.90
0.60
2.15
msa415
General-purpose Schottky diodes
0.30
0.40
0.50
mgs343
solder lands
solder resist
occupied area
0.60
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2010. All rights reserved.
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