BYQ28ED-200,118 NXP Semiconductors, BYQ28ED-200,118 Datasheet
BYQ28ED-200,118
Specifications of BYQ28ED-200,118
BYQ28ED-200 /T3
BYQ28ED-200 /T3
Related parts for BYQ28ED-200,118
BYQ28ED-200,118 Summary of contents
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BYQ28 series E and ED Rectifier diodes ultrafast, rugged Rev. 04 — 5 December 2007 1. Product profile 1.1 General description Ultrafast, dual common cathode, epitaxial rectifier diodes in a SOT78 (TO-220AB) and a SOT428 (DPAK) plastic package. 1.2 Features ...
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... NXP Semiconductors 3. Ordering information Table 2. Ordering information Type number Package Name BYQ28E-200 TO-220AB BYQ28ED-200 DPAK 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V repetitive peak reverse voltage RRM V crest working reverse voltage RWM ...
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... NXP Semiconductors 5. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter R thermal resistance from junction to th(j-mb) mounting base R thermal resistance from junction to ambient in free air; SOT78 th(j-a) [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint th(j-mb) (K/ Fig 1. Transient thermal impedance from junction to mounting base as a function of pulse width ...
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... NXP Semiconductors 6. Characteristics Table 5. Characteristics unless otherwise specified. j Symbol Parameter Static characteristics V forward voltage F I reverse current R Dynamic characteristics Q recovered charge r t reverse recovery time rr I peak reverse recovery RM current V forward recovery FR voltage (1) T (2) T (3) T Fig 2. Forward current as a function of forward voltage ...
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... NXP Semiconductors Fig 3. Reverse recovery definitions 8 P tot (W) 6 0 F(AV) F(RMS) Fig 5. Forward power dissipation as a function of average forward current; square waveform; maximum values BYQ28_SER_E_ED_4 Product data sheet BYQ28 series E and time 100 % 001aab911 Fig 4. Forward recovery definitions 001aag976 ...
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... NXP Semiconductors 7. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB D L DIMENSIONS (mm are the original dimensions UNIT A 1 4.7 1.40 0.9 1.45 mm 4.1 1.25 0.6 1.00 OUTLINE VERSION IEC SOT78 Fig 7. Package outline SOT78 (TO-220AB) BYQ28_SER_E_ED_4 Product data sheet ...
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... NXP Semiconductors Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped DIMENSIONS (mm are the original dimensions) UNIT 2.38 0.93 0.89 1.1 mm 2.22 0.46 0.71 0.9 OUTLINE VERSION IEC SOT428 Fig 8. Package outline SOT428 (TO-252) BYQ28_SER_E_ED_4 Product data sheet BYQ28 series E and ED ...
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... Data sheet status Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Limiting values table: some parameter descriptions amended to conform to latest standards ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 11. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Legal information 9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 9.2 Defi ...