BAT46WFILM STMicroelectronics, BAT46WFILM Datasheet - Page 4

IC DIODE SCHOTTKY SS SOT-323-3

BAT46WFILM

Manufacturer Part Number
BAT46WFILM
Description
IC DIODE SCHOTTKY SS SOT-323-3
Manufacturer
STMicroelectronics
Datasheet

Specifications of BAT46WFILM

Voltage - Forward (vf) (max) @ If
450mV @ 10mA
Voltage - Dc Reverse (vr) (max)
100V
Current - Average Rectified (io)
150mA (DC)
Current - Reverse Leakage @ Vr
5µA @ 75V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Capacitance @ Vr, F
10pF @ 0V, 1MHz
Mounting Type
Surface Mount
Package / Case
SC-70-3, SOT-323-3
Product
Schottky Diodes
Peak Reverse Voltage
100 V
Forward Continuous Current
0.15 A
Max Surge Current
1 A
Configuration
Single
Forward Voltage Drop
1 V at 0.25 A
Maximum Reverse Leakage Current
5 uA at 75 V
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Forward Current If(av)
150mA
Repetitive Reverse Voltage Vrrm Max
100V
Forward Voltage Vf Max
1V
Forward Surge Current Ifsm Max
1A
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-7160-2
BAT46WFILM

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAT46WFILM
Manufacturer:
ST
Quantity:
12 000
Part Number:
BAT46WFILM
Manufacturer:
STMicroelectronics
Quantity:
27 847
Part Number:
BAT46WFILM
Manufacturer:
ST
0
Characteristics
4/11
Figure 7.
Figure 9.
Figure 11. Thermal resistance junction to
1.00
0.10
0.01
600
550
500
450
400
350
300
1.E+00
1.E-01
1.E-02
1.E-02
0
0.0
Single pulse
SOT-23
5
0.1
Forward voltage drop versus
forward current (typical values,
high-level)
Relative variation of thermal
impedance junction to ambient
versus pulse duration -
aluminium oxide substrate
10 mm x 8 mm x 0.5 mm (SOT-23)
ambient versus copper surface
under each lead, epoxy FR4,
e
10
CU
1.E-01
0.2
= 35 µm (SOD-323)
15
0.3
20
0.4
t
S
P
1.E+00
(s)
CU
(mm²)
25
0.5
Tj=125 °C
30
0.6
Alumine substrate
35
1.E+01
0.7
10 x 8 x 0.5 mm
V
FM
0.8
40
(V)
Tj=25 °C
0.9
45
1.E+02
1.0
50
Figure 8.
Figure 10. Variation of thermal impedance
1.00
0.10
0.01
1000
100
10
1.E-02
1.E-02
Single pulse
Single pulse
SOD-323
SOT-323
impedance junction to ambient
versus pulse duration - printed
circuit board, epoxy FR4
e
junction to ambient versus pulse
duration - printed circuit board,
epoxy FR4, e
Relative variation of thermal
CU
1.E-01
1.E-01
= 35 µm (SOD-323)
1.E+00
1.E+00
t
P
t
(s)
P
(s)
CU
= 35 µm (SOT-323)
1.E+01
1.E+01
S
CU
Epoxy FR4
e
CU
=2.25 mm²
=35 µm
BAT46 Series
1.E+02
1.E+02

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