BAT41 STMicroelectronics, BAT41 Datasheet - Page 4

• Manufacturer Part Number: BAT41
• Description: DIODE SCHOTTKY 100V 100MA DO-35
• Manufacturer: STMicroelectronics

Specifications of BAT41

• Voltage - Forward (vf) (max) @ If: 450mV @ 1mA
• Voltage - Dc Reverse (vr) (max): 100V
• Current - Average Rectified (io): 100mA (DC)
• Current - Reverse Leakage @ Vr: 100nA @ 50V
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Capacitance @ Vr, F: 2pF @ 1V, 1MHz
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Product: Schottky Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.1 A
• Max Surge Current: 0.75 A
• Configuration: Single
• Forward Voltage Drop: 1 V @ 0.2 A
• Maximum Reverse Leakage Current: 0.1 uA @ 50 V
• Operating Temperature Range: - 65 C to + 125 C
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-2493-2

Characteristics
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead
4/12
Figure 7.
Figure 9.
1.00
0.10
0.01
1.E+00
1.E-02
1.E-01
1.E-02
1.E-03
1.E-04
Z
Single pulse
Allumine substrate, SOT-23
th(j-a)
printed circuit board, epoxy Fr4, e = 35 µm, SOD-323
0.0
I
FM
/R
Alumine substrate
(A)
0.1
10 x 8 x 0.5 mm
th(j-a)
Forward voltage drop versus
forward current (typical values)
Relative variation of thermal
impedance junction to ambient
versus pulse duration
SOT-23
0.2
1.E-01
0.3
S
T =100°C
CU
j
e
Epoxy FR4
CU
SOD-323
0.4
= 2.25 mm
= 35 µm
T =125°C
0.5
j
1.E+00
2
V
CU
FM
0.6
(V)
0.7
600
550
500
450
400
350
300
0
R
0.8
th(j-a)
1.E+01
T =25°C
j
0.9
5
(°C/W)
1.0
10
Doc ID 12633 Rev 2
1.1
t (s)
p
15
1.E+02
printed circuit board, epoxy Fr4, e = 35 µm, SOD-323
1.2
20
S
CU
Figure 8.
Figure 10. Relative variation of thermal
25
(mm²)
1.00
0.10
0.01
30
1.E-03
1000
100
10
Z
1.E-02
Single pulse
th(j-a)
Z
35
Single pulse
th(j-a)
SOT323-6L
printed circuit board, epoxy FR4, e = 35 µm, SOT323-6L
printed circuit board, epoxy FR4, e = 35 µm, SOT-666 and SOD-523
CU
/R
e
40
(°C/W)
th(j-a)
Epoxy FR4
CU
SOD-523
Variation of thermal impedance
junction to ambient versus pulse
duration
impedance junction to ambient
versus pulse duration
= 35 µm
1.E-02
1.E-01
45
e
Epoxy FR4
CU
SOT-666
50
= 35 µm
1.E+00
1.E-01
CU
CU
1.E+01
1.E+00
t (s)
p
t (s)
p
1.E+02
BAT41
1.E+01