STTH110 STMicroelectronics, STTH110 Datasheet - Page 3

• Manufacturer Part Number: STTH110
• Description: DIODE ULTRA FAST 1KV 1A DO41
• Manufacturer: STMicroelectronics

Specifications of STTH110

• Voltage - Forward (vf) (max) @ If: 1.7V @ 1A
• Voltage - Dc Reverse (vr) (max): 1000V (1kV)
• Current - Average Rectified (io): 1A
• Current - Reverse Leakage @ Vr: 10µA @ 1000V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 75ns
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO-41, Axial
• Rectifier Type: Switching Diode
• Configuration: Single
• Peak Rep Rev Volt: 1000V
• Avg. Forward Curr (max): 1
• Rev Curr: 10uA
• Peak Non-repetitive Surge Current (max): 20A
• Forward Voltage: 1.7V
• Operating Temp Range: -50C to 175C
• Package Type: DO-41
• Rev Recov Time: 75ns
• Operating Temperature Classification: Automotive
• Mounting: Through Hole
• Pin Count: 2
• Product: Ultra Fast Recovery Rectifier
• Reverse Voltage: 1000 V
• Forward Voltage Drop: 1.7 V
• Recovery Time: 75 ns
• Forward Continuous Current: 1 A
• Max Surge Current: 20 A
• Reverse Current Ir: 10 uA
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 175 C
• Minimum Operating Temperature: - 50 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 497-2444-3

STTH110
Figure 1.
Figure 3.
Figure 5.
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
120
110
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
90
80
70
60
50
40
30
20
10
1.E-01
0
0.0
P(W)
0
Z
R
epoxy FR4, leads = 10 mm
th(j-c)
δ = 0.5
δ = 0.2
Single pulse
δ = 0.1
th(j-a)
0.1
1
/R
(°C/W)
0.2
th(j-c)
Conduction losses versus average
current
Relative variation of thermal
impedance junction ambient versus
pulse duration (DO-41)
Thermal resistance junction to
ambient versus copper surface
under each lead (DO-41)
1.E+00
2
0.3
δ = 0.05
epoxy printed circuit board FR4, copper thickness: 35 µm
3
0.4
0.5
4
δ = 0.1
I
F(AV)
1.E+01
S(cm²)
t (s)
p
0.6
5
(A)
δ = 0.2
0.7
6
0.8
1.E+02
δ = 0.5
7
0.9
δ
δ
=tp/T
=tp/T
8
1.0
T
δ = 1
T
Doc ID 9344 Rev 2
9
1.1
tp
tp
1.E+03
1.2
10
Figure 2.
Figure 4.
Figure 6.
100.0
140
130
120
110
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
10.0
90
80
70
60
50
40
30
20
10
1.E-01
1.0
0.1
0
0.0
Z
R
0.0
th(j-c)
I
th(j-a)
δ = 0.5
Single pulse
FM
δ = 0.2
δ = 0.1
(A)
0.5
(typical values)
/R
0.5
(°C/W)
T =150°C
j
th(j-c)
1.0
Forward voltage drop versus
forward current
Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4) (SMA)
Thermal resistance junction to
ambient versus copper surface
under each lead (SMA).
1.E+00
1.0
(maximum values)
epoxy printed circuit board FR4, copper thickness: 35 µm
T =150°C
1.5
j
1.5
2.0
2.0
1.E+01
S(cm²)
t (s)
V
p
FM
2.5
(maximum values)
(V)
2.5
T =25°C
3.0
j
3.0
3.5
1.E+02
Characteristics
δ
3.5
=tp/T
4.0
T
4.0
4.5
tp
1.E+03
4.5
5.0
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