STPS3150U STMicroelectronics, STPS3150U Datasheet - Page 5

DIODE SCHOTTKY 3A 150V SMB

STPS3150U

Manufacturer Part Number
STPS3150U
Description
DIODE SCHOTTKY 3A 150V SMB
Manufacturer
STMicroelectronics
Datasheet

Specifications of STPS3150U

Voltage - Forward (vf) (max) @ If
820mV @ 3A
Voltage - Dc Reverse (vr) (max)
150V
Current - Average Rectified (io)
3A
Current - Reverse Leakage @ Vr
2µA @ 150V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type
Surface Mount
Package / Case
DO-214AA, SMB
Product
Schottky Rectifiers
Peak Reverse Voltage
150 V
Forward Continuous Current
3 A
Max Surge Current
100 A
Configuration
Single
Forward Voltage Drop
0.89 V at 6 A
Maximum Reverse Leakage Current
2 uA
Operating Temperature Range
+ 175 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
Compliant
Other names
497-6583-2
STPS3150U

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STPS3150U
Manufacturer:
ST
Quantity:
60 000
Part Number:
STPS3150U
Manufacturer:
ST
Quantity:
50 000
Part Number:
STPS3150U
Manufacturer:
ST
Quantity:
200
Part Number:
STPS3150U
Manufacturer:
ST
Quantity:
20 000
Part Number:
STPS3150U
0
Company:
Part Number:
STPS3150U
Quantity:
10 000
Part Number:
STPS3150U-ST
Manufacturer:
ST
0
Part Number:
STPS3150UF
Manufacturer:
STMicroelectronics
Quantity:
37 232
Part Number:
STPS3150UF
Manufacturer:
ST
0
Part Number:
STPS3150UF
Manufacturer:
ST
Quantity:
20 000
Part Number:
STPS3150UY
Manufacturer:
ST
0
Part Number:
STPS3150UY
0
STPS3150
Figure 15. Thermal resistance junction to
Figure 17. Thermal resistance junction to
110
100
110
100
90
80
70
60
50
40
30
20
10
90
80
70
60
50
40
30
20
10
0
0
0.0
0.0
R
R
th(j-a)
th(j-a)
0.5
0.5
(°C/W)
(°C/W)
ambient versus copper surface
under each lead (epoxy printed
board FR4, e
ambient versus copper surface
under each lead (epoxy printed
board FR4, e
1.0
1.0
1.5
1.5
SMB flat
2.0
2.0
S
S (cm²)
CU
Cu
2.5
2.5
(cm²)
CU
CU
= 35 µm) (SMB)
= 35 µm) (SMB flat)
3.0
3.0
3.5
3.5
4.0
4.0
SMB
4.5
4.5
5.0
5.0
Figure 16. Thermal resistance junction to
90
80
70
60
50
40
30
20
10
0
5
R (°C/W)
th
ambient versus copper surface
under each lead (epoxy printed
board FR4, e
(DO-201AD)
10
L
leads
R
R
15
th(j-a)
th(j-I)
CU
(mm)
= 35 µm)
Characteristics
20
DO-201AD
25
5/10

Related parts for STPS3150U