BAS21HT1G ON Semiconductor, BAS21HT1G Datasheet - Page 4

• Manufacturer Part Number: BAS21HT1G
• Description: DIODE SWITCH 200MA 250V SOD323
• Manufacturer: ON Semiconductor

Specifications of BAS21HT1G

• Voltage - Forward (vf) (max) @ If: 1.25V @ 200mA
• Voltage - Dc Reverse (vr) (max): 250V
• Current - Average Rectified (io): 200mA (DC)
• Current - Reverse Leakage @ Vr: 100nA @ 200V
• Diode Type: Standard
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 50ns
• Capacitance @ Vr, F: 5pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: SC-76, SOD-323, UMD2
• Product: Switching Diodes
• Peak Reverse Voltage: 250 V
• Forward Continuous Current: 0.2 A
• Configuration: Single
• Recovery Time: 50 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.1 uA
• Operating Temperature Range: - 55 C to + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Mounting Style: SMD/SMT
• Rectifier Type: Small Signal Switching Diode
• Peak Rep Rev Volt: 250V
• Avg. Forward Curr (max): 0.2A
• Rev Curr: 0.1uA
• Forward Voltage: 1.25V
• Operating Temp Range: -55C to 150C
• Package Type: SOD-323
• Rev Recov Time: 50ns
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 2
• Forward Current If(av): 200mA
• Repetitive Reverse Voltage Vrrm Max: 250V
• Forward Voltage Vf Max: 1V
• Reverse Recovery Time Trr Max: 50ns
• Forward Surge Current Ifsm Max: 625mA
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: BAS21HT1GOSTR

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NOTE 3
C
b
1
NOTE 5
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
L
H
D
E
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
E
A1
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
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PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
PLASTIC PACKAGE
http://onsemi.com
CASE 477−02
SOD−323
ISSUE G
A3
0.025
A
0.63
0.063
0.112
1.60
2.85
4
NOTES:
0.033
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
5. DIMENSION L IS MEASURED FROM END OF
0.83
Y14.5M, 1982.
WITH SOLDER PLATING.
FLASH, PROTRUSIONS OR GATE BURRS.
RADIUS.
STYLE 1:
DIM
H
A1
A3
A
C
D
E
b
L
PIN 1. CATHODE
E
0.089
2. ANODE
MIN
0.80
0.00
0.25
1.60
1.15
0.08
2.30
MILLIMETERS
0.15 REF
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NOM
0.90
0.05
0.32
0.12
1.70
1.25
2.50
0.177
MAX
1.00
0.10
1.80
1.35
2.70
0.4
0.031
0.000
0.010
0.003
0.062
0.045
0.003
0.090
MIN
0.006 REF
INCHES
0.035 0.040
0.002 0.004
0.012 0.016
0.005 0.007
0.066 0.070
0.049 0.053
0.098 0.105
NOM
BAS21HT1/D
MAX