MBRM120ET1G ON Semiconductor, MBRM120ET1G Datasheet - Page 6

• Manufacturer Part Number: MBRM120ET1G
• Description: DIODE SCHOTTKY 1A 20V POWERMITE
• Manufacturer: ON Semiconductor

Specifications of MBRM120ET1G

• Voltage - Forward (vf) (max) @ If: 530mV @ 1A
• Voltage - Dc Reverse (vr) (max): 20V
• Current - Average Rectified (io): 1A
• Current - Reverse Leakage @ Vr: 10µA @ 20V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• Package / Case: Powermite®
• Product: Schottky Diodes
• Peak Reverse Voltage: 20 V
• Forward Continuous Current: 1 A
• Max Surge Current: 50 A
• Configuration: Single
• Forward Voltage Drop: 0.595 V @ 2 A
• Maximum Reverse Leakage Current: 10 uA
• Operating Temperature Range: - 65 C to + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MBRM120ET1G; MBRM120ET1GOSTR

PUBLICATION ORDERING INFORMATION
POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.
LITERATURE FULFILLMENT:
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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−A−
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
S
R
−B−
J
*For additional information on our Pb−Free strategy and soldering
H
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
C
−T−
0.100
2.54
J
L
0.08 (0.003)
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
SOLDERING FOOTPRINT*
PLASTIC PACKAGE
0.105
http://onsemi.com
2.67
CASE 457−04
POWERMITE
MBRM120E
M
ISSUE D
D
T
0.08 (0.003)
F
6
B
S
TERM. 1
C
TERM. 2
SCALE 10:1
S
M
T
0.635
0.025
B
0.762
0.030
S
inches
0.050
mm
C
1.27
S
NOTES:
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
Y14.5M, 1982.
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
DIM
A
B
C
D
F
H
J
K
L
R
S
−0.05
MILLIMETERS
MIN
1.75
1.75
0.85
0.40
0.70
0.10
3.60
0.50
1.20
0.50 REF
+0.10 −0.002 +0.004
MAX
2.05
2.18
1.15
0.69
1.00
0.25
3.90
0.80
1.50
0.069
0.069
0.033
0.016
0.028
0.004
0.142
0.020
0.047
MIN
MBRM120E/D
0.019 REF
INCHES
0.081
0.086
0.045
0.027
0.039
0.010
0.154
0.031
0.059
MAX