MBRS360T3G ON Semiconductor, MBRS360T3G Datasheet

MBRS360T3G

Manufacturer Part Number

MBRS360T3G

Description

DIODE SCHOTTKY 60V 3A SMC

Manufacturer

ON Semiconductor

Datasheets

1.MBRS360T3G.pdf (6 pages)

2.MBRS360T3G.pdf (4 pages)

Specifications of MBRS360T3G

Voltage - Forward (vf) (max) @ If

740mV @ 3A

Voltage - Dc Reverse (vr) (max)

60V

Current - Average Rectified (io)

Current - Reverse Leakage @ Vr

150µA @ 60V

Diode Type

Schottky

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Mounting Type

Surface Mount

Package / Case

DO-214AB, SMC

Product

Schottky Diodes

Peak Reverse Voltage

60 V

Forward Continuous Current

4 A

Max Surge Current

125 A

Configuration

Single

Forward Voltage Drop

0.74 V @ 3 A

Maximum Reverse Leakage Current

150 uA

Operating Temperature Range

- 65 C to + 175 C

Mounting Style

SMD/SMT

Current, Forward

4 A

Current, Reverse

10 mA

Current, Surge

125 A

Package Type

SMC

Primary Type

Schottky Barrier

Temperature, Junction, Maximum

+175 °C

Temperature, Operating

-65 to +175 °C

Voltage, Forward

0.74 V

Voltage, Reverse

60 V

Rectifier Type

Schottky Diode

Peak Rep Rev Volt

60V

Avg. Forward Curr (max)

Rev Curr

150uA

Peak Non-repetitive Surge Current (max)

125A

Forward Voltage

0.74V

Operating Temp Range

-65C to 175C

Operating Temperature Classification

Military

Mounting

Surface Mount

Pin Count

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Reverse Recovery Time (trr)

Capacitance @ Vr, F

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Other names

MBRS360T3GOSTR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MBRS360T3G

Quantity:

5 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MBRS360T3G

Manufacturer:

Quantity:

30 000

Company:

BOSTOCK HK LIMITED

Part Number:

MBRS360T3G

Manufacturer:

Quantity:

2 630

Company:

Meier Automation Equipment Co., Limited

Part Number:

MBRS360T3G

Manufacturer:

ON/安森美

Quantity:

20 000

Company:

Amily Shenzhen XNWY Technology Co., Ltd

Part Number:

MBRS360T3G

Company:

H&T Electronics

Part Number:

MBRS360T3G

Quantity:

200

Company:

H&T Electronics

Part Number:

MBRS360T3G

Quantity:

1 675

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MBRS360T3G B36

Manufacturer:

RENESAS

Quantity:

2 822

Company:

Meier Automation Equipment Co., Limited

Part Number:

MBRS360T3G B36

Manufacturer:

ON/安森美

Quantity:

20 000

Current page: 1 of 6
Download datasheet (138Kb)

MBRS360T3, MBRS360BT3G

Surface Mount

Schottky Power Rectifier

metal−to−silicon power diode. State−of−the−art geometry features

epitaxial construction with oxide passivation and metal overlay

contact. Ideally suited for low voltage, high frequency rectification, or

as free wheeling and polarity protection diodes, in surface mount

applications where compact size and weight are critical to the system.

Features

•

Mechanical Characteristics

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. The heat generated must be less than the thermal conductivity from

MAXIMUM RATINGS

January, 2010 − Rev. 7

Peak Repetitive Reverse Voltage

Average Rectified Forward Current

Nonrepetitive Peak Surge Current

Storage Temperature Range

Operating Junction Temperature

This device employs the Schottky Barrier principle in a large area

Leads are Readily Solderable

260°C Max. for 10 Seconds

Small Compact Surface Mountable Package with J−Bend Leads

Rectangular Package for Automated Handling

Highly Stable Oxide Passivated Junction

Excellent Ability to Withstand Reverse Avalanche Energy Transients

Guard−Ring for Stress Protection

Pb−Free Package is Available

Case: Epoxy, Molded, Epoxy Meets UL 94 V−0

Weight: 217 mg (Approximately), SMC

Finish: All External Surfaces Corrosion Resistant and Terminal

Lead and Mounting Surface Temperature for Soldering Purposes:

Polarity: Notch in Plastic Body Indicates Cathode Lead

Device Meets MSL 1 Requirements

ESD Ratings: Machine Model, C

Junction−to−Ambient: dP

Working Peak Reverse Voltage

DC Blocking Voltage

(Surge applied at rated load

conditions halfwave, single

phase, 60 Hz)

(Note 1)

95 mg (Approximately), SMB

Rating

Human Body Model, 3B

/dT

< 1/R

qJA

Symbol

F(AV)

FSM

RWM

RRM

stg

3.0 @ T

4.0 @ T

− 65 to +175

Value

125

= 137°C

= 127°C

Unit

°C

MBRS360T3G

MBRS360BT3G

†For information on tape and reel specifications,

MBRS360T3

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

Device

3.0 AMPERES, 60 VOLTS

CASE 403

PLASTIC

SCHOTTKY BARRIER

B36

(Note: Microdot may be in either location)

ORDERING INFORMATION

SMC

AYWW

B36G

MARKING DIAGRAMS

http://onsemi.com

RECTIFIERS

= Specific Device Code

= Assembly Location

= Year

= Work Week

= Pb−Free Package

(Pb−Free)

Package

SMC

SMB

SMC

Publication Order Number:

CASE 403A

2500/Tape & Reel

PLASTIC

SMB

AYWW

Shipping

MBRS360T3/D

B36G

†

Related parts for MBRS360T3G

MBRS360T3G Summary of contents

Page 1

... Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping MBRS360T3 SMC 2500/Tape & Reel MBRS360T3G SMC 2500/Tape & Reel (Pb−Free) MBRS360BT3G SMB 2500/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D ...

Page 2

THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (Note 2) Thermal Resistance, Junction−to−Ambient (Note 2) Thermal Resistance, Junction−to−Ambient (Note 3) ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3 25° Maximum Instantaneous Reverse Current (Note ...

Page 3

SQUARE WAVE ...

Page 4

D = 0.5 0.2 10 0.1 0.05 1 0.01 SINGLE PULSE 0.1 0.00001 0.0001 0.001 Figure 8. Thermal Response, Junction−to−Ambient, SMC Package 100 50% Duty Cycle 20% 10 0.1 Single Pulse 0.01 0.000001 0.00001 ...

Page 5

... 3.810 0.150 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SMC PLASTIC PACKAGE CASE 403−03 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. ...

Page 6

... Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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