STTH10R04G-TR STMicroelectronics, STTH10R04G-TR Datasheet - Page 5
STTH10R04G-TR
Manufacturer Part Number
STTH10R04G-TR
Description
DIODE ULT FAST 400V 10A D2PAK
Manufacturer
STMicroelectronics
Datasheet
1.STTH10R04D.pdf
(11 pages)
Specifications of STTH10R04G-TR
Voltage - Forward (vf) (max) @ If
1.7V @ 10A
Voltage - Dc Reverse (vr) (max)
400V
Current - Average Rectified (io)
10A
Current - Reverse Leakage @ Vr
10µA @ 400V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
40ns
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Product
Ultra Fast Recovery Rectifier
Configuration
Single
Reverse Voltage
400 V
Forward Voltage Drop
1.7 V
Recovery Time
40 ns
Forward Continuous Current
10 A
Max Surge Current
100 A
Reverse Current Ir
10 uA
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 175 C
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
Details
Other names
497-7575-2
STTH10R04G-TR
STTH10R04G-TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
STTH10R04
Figure 11. Forward recovery time
Figure 13. Thermal resistance, junction to
80
70
60
50
40
30
20
10
200
180
160
140
120
100
0
80
60
40
20
0
0
t (ns)
0
fr
50
5
versus dI
ambient, versus copper surface
under tab (epoxy printed board
FR4, copper thickness = 35 µm)
D
100
2
PAK
10
150
15
200
dI /dt(A/µs)
F
F
S
/dt (typical values)
CU
(cm²)
250
20
300
25
350
30
V
FR
400
=1.1 x V
T
I
j
F
=125°C
=I
F(AV)
D²PAK
35
F
450
max.
500
40
Figure 12. Junction capacitance versus
Figure 14. Thermal resistance, junction to
100
10
100
90
80
70
60
50
40
30
20
10
0
1
0
5
reverse voltage applied (typical
values)
ambient, versus copper surface
under tab (epoxy printed board
FR4, copper thickness = 35 µm)
DPAK
10
10
15
V
R
S
(V)
CU
20
(cm²)
25
100
Characteristics
30
V
OSC
F=1MHz
T
=30mV
j
=25°C
35
DPAK
RMS
1000
40
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