AXK6F80547YG PANASONIC EW, AXK6F80547YG Datasheet - Page 3

• Manufacturer Part Number: AXK6F80547YG
• Description: Header Connector,PCB Mount,PLUG,80 Contacts,SKT,0.02 Pitch,SURFACE MOUNT Terminal
• Manufacturer: PANASONIC EW

SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Electrical
characteristics
Mechanical
characteristics
Environmental
characteristics
Lifetime
characteristics
Unit weight
Molded portion
Contact/Post
Part name
Rated current
Rated voltage
Breakdown voltage
Insulation resistance
Contact resistance
Composite insertion force
Composite removal force
Contact holding force
Ambient temperature
Soldering heat resistance
Storage temperature
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H
(header and socket mated)
Insertion and removal life
2
S resistance
Item
LCP resin (UL94V-0)
Copper alloy
Mated height 1.5mm, 20 contacts; Socket: 0.06g
Header: 0.04g
300°C within 5 seconds, 350°C within 3 seconds Soldering iron
Max. peak temperature of 260°C (on the surface
of the PC board around the connector terminals)
5 cycles,
120 hours, insulation resistance min. 100MΩ,
24 hours,
48 hours,
50 times
Material
0.5A/contact (Max. 10 A at total contacts)
Max. 0.981N/contacts × contacts (initial)
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Min. 0.0588N/contacts × contacts
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
contact resistance max. 90mΩ
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
contact resistance max. 90mΩ
150V AC for 1 minute
Min. 1,000MΩ (initial)
Min. 0.981N/contact
–55°C to +85°C
Specifications
60V AC/DC
Max. 90mΩ
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
(The nickel base is exposed.)
The section close to the soldering portion has a nickel barrier.
Detection current: 1mA
Using 500V DC megger
Based on the contact resistance measurement method specified by
JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures
Infrared reflow soldering
No freezing at low temperatures. No dew condensation.
Sequence
1. –55 °C, 30 minutes
2. ~ , Max. 5 minutes
3. 85 °C, 30 minutes
4. ~ , Max. 5 minutes
Bath temperature 40±2°C, humidity 90 to 95% R.H.
Bath temperature 35±2°C, saltwarter concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/hours
panasonic-electric-works.net/ac
+3
0
–3
0
Surface treatment
—
Conditions
AXK(5/6)F