BAS16,235 NXP Semiconductors, BAS16,235 Datasheet - Page 16

• Manufacturer Part Number: BAS16,235
• Description: DIODE SW 85V 215MA HI-SPD SOT-23
• Manufacturer: NXP Semiconductors

Specifications of BAS16,235

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Voltage - Dc Reverse (vr) (max): 100V
• Current - Average Rectified (io): 215mA (DC)
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 4ns
• Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.215 A
• Max Surge Current: 4 A
• Configuration: Single
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 933460620235; BAS16 /T3; BAS16 /T3

NXP Semiconductors
BAS16_SER_5
Product data sheet
Fig 27. Wave soldering footprint BAS16W (SOT323/SC-70)
Fig 28. Reflow soldering footprint BAS316 (SOD323/SC-76)
3.65 2.1
1.65
0.95
(2 )
(2 )
0.5
0.6
1.425
(3 )
Rev. 05 — 25 August 2008
3.05
2.1
2.2
2.575
4.6
0.5 (2 )
(2 )
09
0.6 (2 )
1.8
High-speed switching diodes
BAS16 series
Dimensions in mm
direction during soldering
Dimensions in mm
© NXP B.V. 2008. All rights reserved.
preferred transport
solder lands
solder resist
solder paste
occupied area
solder lands
solder resist
occupied area
sod323_fr
sot323_fw
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