BAS70,235 NXP Semiconductors, BAS70,235 Datasheet - Page 11

• Manufacturer Part Number: BAS70,235
• Description: DIODE SCHOTTKY 70V 70MA SOT-23
• Manufacturer: NXP Semiconductors

Specifications of BAS70,235

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1V @ 15mA
• Voltage - Dc Reverse (vr) (max): 70V
• Current - Average Rectified (io): 70mA (DC)
• Current - Reverse Leakage @ Vr: 10µA @ 70V
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Capacitance @ Vr, F: 2pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 70 V
• Forward Continuous Current: 0.07 A
• Max Surge Current: 0.1 A
• Configuration: Single
• Forward Voltage Drop: 1 V @ 0.015 A
• Maximum Reverse Leakage Current: 10 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934020790235; BAS70 /T3; BAS70 /T3

NXP Semiconductors
10. Soldering
BAS70_1PS7XSB70_SER_9
Product data sheet
Fig 14. Reflow soldering footprint SOD323 (SC-76)
Fig 15. Wave soldering footprint SOD323 (SC-76)
Fig 16. Reflow soldering footprint SOD523 (SC-79)
Dimensions in mm
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
2.75
0.95
1.20
BAS70 series; 1PS7xSB70 series
Rev. 09 — 13 January 2010
0.50
(2×)
solder lands
solder resist
occupied area
solder paste
preferred transport direction during soldering
3.05
2.80
2.10
1.60
1.20
5.00
4.40
1.40
0.50
msa433
1.80
1.90
0.60
2.15
General-purpose Schottky diodes
msa415
0.30
0.40
0.50
mgs343
0.60
solder lands
solder resist
occupied area
solder paste
solder lands
solder resist
occupied area
© NXP B.V. 2010. All rights reserved.
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