STPS2L30A STMicroelectronics, STPS2L30A Datasheet - Page 5

• Manufacturer Part Number: STPS2L30A
• Description: DIODE SCHOTTKY 30V 2A SMA
• Manufacturer: STMicroelectronics

Specifications of STPS2L30A

• Voltage - Forward (vf) (max) @ If: 450mV @ 2A
• Voltage - Dc Reverse (vr) (max): 30V
• Current - Average Rectified (io): 2A
• Current - Reverse Leakage @ Vr: 200µA @ 30V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• Package / Case: DO-214AC, SMA
• Product: Schottky Rectifiers
• Peak Reverse Voltage: 30 V
• Forward Continuous Current: 2 A
• Max Surge Current: 75 A
• Configuration: Single
• Forward Voltage Drop: 0.53 V at 4 A
• Maximum Reverse Leakage Current: 200 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-3759-2

STPS2L30
Figure 13. Reverse leakage current versus
Figure 15. Forward voltage drop versus
Figure 17. Thermal resistance junction to
1.E+02
1.E+01
1.E+00
10.0
130
120
110
100
1.E-01
1.E-02
1.E-03
1.0
0.1
90
80
70
60
50
40
30
20
10
0
0.0
0.0
R
I
FM
th(j-a)
0
I (mA)
R
(A)
(typical values)
0.5
T
(°C/W)
j
=125 °C
0.1
(maximum values)
(maximum values)
reverse voltage applied (typical
values)
forward current (high level)
ambient versus copper surface
under each lead (epoxy printed
board FR4, copper
thickness = 35 µm) (SMA, SMB flat)
1.0
T
T
5
j
j
=125 °C
=125 °C
SMA
0.2
1.5
10
2.0
0.3
S
SMB flat)
CU
T =150°C
T =125°C
T =100°C
T =25°C
V (V)
j
j
j
j
2.5
(Cm²)
R
15
0.4
V
3.0
FM
(V)
20
3.5
(maximum values)
0.5
T
j
=25 °C
4.0
25
0.6
4.5
0.7
5.0
30
Figure 14. Junction capacitance versus
Figure 16. Forward voltage drop versus
Figure 18. Thermal resistance junction to
1000
3.0
2.5
2.0
1.5
1.0
0.5
0.0
200
180
160
140
120
100
100
80
60
40
20
10
0
0.0
0.0
I
R
FM
1
C(pF)
th(j-a)
(A)
0.5
(°C/W)
0.1
(typical values)
(maximum values)
(maximum values)
T
reverse voltage applied (typical
values)
forward current ( low level)
ambient versus copper surface
under each lead (epoxy printed
board FR4, copper
thickness = 35 µm) (SMA flat)
j
=125 °C
1.0
T
T
j
j
=125 °C
=125 °C
1.5
0.2
2.0
S
V (V)
CU
0.3
2.5
R
10
(Cm²)
3.0
0.4
3.5
Characteristics
V
FM
(V)
4.0
(maximum values)
0.5
V
T
OSC
j
=25 °C
SMA-Flat
F=1MHz
T =25°C
=30mV
j
4.5
RMS
100
5.0
0.6
5/10