STTH310S STMicroelectronics, STTH310S Datasheet - Page 3
STTH310S
Manufacturer Part Number
STTH310S
Description
DIODE ULT FAST 3A 1000V SMC
Manufacturer
STMicroelectronics
Datasheet
1.STTH310RL.pdf
(7 pages)
Specifications of STTH310S
Voltage - Forward (vf) (max) @ If
1.7V @ 3A
Voltage - Dc Reverse (vr) (max)
1000V (1kV)
Current - Average Rectified (io)
3A
Current - Reverse Leakage @ Vr
10µA @ 1000V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
75ns
Mounting Type
Surface Mount
Package / Case
DO-214AB, SMC
Product
Ultra Fast Recovery Rectifier
Configuration
Single
Reverse Voltage
1000 V
Forward Voltage Drop
1.7 V
Recovery Time
75 ns
Forward Continuous Current
3 A
Max Surge Current
45 A
Reverse Current Ir
10 uA
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 175 C
Minimum Operating Temperature
- 50 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-8053-2
STTH310S
STTH310S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STTH310S
Manufacturer:
STMicroelectronics
Quantity:
11 682
Company:
Part Number:
STTH310S
Manufacturer:
STMicroelectronics
Quantity:
450
Part Number:
STTH310S
Manufacturer:
VISHAY/威世
Quantity:
20 000
STTH310
Figure 5.
Figure 1.
Figure 3.
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-01
0.0
P(W)
Z
th(j-c)
δ = 0.5
δ = 0.2
δ = 0.1
Epoxy printed circuit board, FR4,
L
leads
= 10 mm
/R
0.5
th(j-c)
Conduction losses versus
average current
Relative variation of thermal
impedance junction ambient
versus pulse duration (DO-201AD)
Thermal resistance junction to ambient versus copper surface under each lead
1.E+00
Single pulse
δ = 0.05
1.0
1.5
δ = 0.1
I
F(AV)
1.E+01
t (s)
p
(A)
110
100
2.0
δ = 0.2
90
80
70
60
50
40
30
20
10
0
0
R
th(j-a)
1.E+02
2.5
δ = 0.5
(°C/W)
δ
=tp/T
δ
=tp/T
1
3.0
T
T
δ = 1
Doc ID 9346 Rev 3
tp
1.E+03
tp
3.5
2
L
S(cm²)
DO-201AD
leads
Figure 2.
Figure 4.
=10mm
SMB
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
100.0
10.0
1.E-01
Epoxy printed circuit board, FR4,
copper thickness = 35 µm
1.0
0.1
3
Z
0.0
Epoxy printed circuit board, FR4,
S = 1cm
th(j-c)
δ = 0.5
Single pulse
δ = 0.2
δ = 0.1
I
FM
(A)
/R
2
th(j-c)
Forward voltage drop versus
forward current
Relative variation of thermal
impedance junction ambient
versus pulse duration (SMC)
0.5
4
1.E+00
(typical values)
T =150°C
j
1.0
5
(maximum values)
1.E+01
t (s)
p
T =150°C
j
1.5
V
FM
(V)
(maximum values)
2.0
1.E+02
Characteristics
T =25°C
j
δ
=tp/T
2.5
T
tp
1.E+03
3/7