STTH2002D STMicroelectronics, STTH2002D Datasheet - Page 4

DIODE ULT FAST 200V 20A TO-220AC

STTH2002D

Manufacturer Part Number
STTH2002D
Description
DIODE ULT FAST 200V 20A TO-220AC
Manufacturer
STMicroelectronics
Datasheet

Specifications of STTH2002D

Voltage - Forward (vf) (max) @ If
1.1V @ 20A
Voltage - Dc Reverse (vr) (max)
200V
Current - Average Rectified (io)
20A
Current - Reverse Leakage @ Vr
10µA @ 200V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
40ns
Mounting Type
Through Hole
Package / Case
TO-220-2, TO-220AC
Product
Ultra Fast Recovery Rectifier
Configuration
Single
Reverse Voltage
200 V
Forward Voltage Drop
1.15 V at 25 A
Recovery Time
40 ns
Forward Continuous Current
20 A
Max Surge Current
175 A
Reverse Current Ir
10 uA
Mounting Style
Through Hole
Maximum Operating Temperature
+ 175 C
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
 Details
Other names
497-5276-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STTH2002DI
Manufacturer:
STMicroelectronics
Quantity:
1 000
Part Number:
STTH2002DI
Manufacturer:
SANYO
Quantity:
20 000
Part Number:
STTH2002DI
Manufacturer:
ST
0
Characteristics
4/10
Figure 5.
Figure 7.
Figure 9.
1000
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
80
70
60
50
40
30
20
10
100
0
10
10
25
1
V
I
R
F
= 160 V
=20 A
Junction capacitance versus
reverse applied voltage (typical
values)
Reverse recovery time versus
dI
Dynamic parameters versus
junction temperature
50
F
/dt (typical values)
I
RM
10
Q
RR
75
V
100
R
dI
(V)
T
F
/dt(A/µs)
j
T
(°C)
T
j
j
= 25 °C
= 125 °C
100
100
125
V
osc
F=1MHz
T
V
=30mV
I
j
R
=25°C
F
=20A
=160V
RMS
1000
1000
150
Figure 6.
Figure 8.
Figure 10. Thermal resistance, junction to
80
70
60
50
40
30
20
10
400
350
300
250
200
150
100
20
18
16
14
12
10
0
50
8
6
4
2
0
0
0
10
10
V
I
R
F
V
= 160 V
= 20 A
I
R
F
= 160 V
= 20 A
5
Reverse recovery charges versus
dI
Peak reverse recovery current
versus dI
ambient, versus copper surface
under tab (Epoxy printed circuit
board FR4, e
F
/dt (typical values)
10
15
F
/dt (typical values)
S
CU
100
(cm²)
100
20
cu
T
j
=125 °C
= 35 µm) for D
T
j
T
=125 °C
25
j
=25 °C
30
dI
dI
F
/dt(A/µs)
F
/dt(A/µs)
T
j
=25 °C
35
STTH2002
D²PAK
1000
1000
2
40
PAK

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