NSD914F3T5G ON Semiconductor, NSD914F3T5G Datasheet - Page 4

IC DIODE SW HS 100V SOT-1123

NSD914F3T5G

Manufacturer Part Number
NSD914F3T5G
Description
IC DIODE SW HS 100V SOT-1123
Manufacturer
ON Semiconductor
Datasheet

Specifications of NSD914F3T5G

Voltage - Forward (vf) (max) @ If
1V @ 10mA
Voltage - Dc Reverse (vr) (max)
100V
Current - Average Rectified (io)
200mA (DC)
Current - Reverse Leakage @ Vr
5µA @ 75V
Diode Type
Standard
Speed
Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr)
4ns
Capacitance @ Vr, F
4pF @ 0V, 1MHz
Mounting Type
Surface Mount
Package / Case
SOT-1123
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NSD914F3T5G
Quantity:
24 000
PUBLICATION ORDERING INFORMATION
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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e
c
b1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
1
2
H
D
E
3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−X−
L
b
A
0.08 (0.0032) X Y
E
−Y−
0.25
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
0.35
0.90
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 524AA−01
SOT−1123
ISSUE A
4
DIMENSIONS: MILLIMETERS
0.30
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
0.40
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM
H
b1
A
D
E
b
c
e
L
E
0.34
0.15
0.10
0.07
0.75
0.55
0.95
0.05
MIN
MILLIMETERS
NOM
0.37
0.20
0.15
0.12
0.80
0.60
0.35
1.00
0.10
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
0.40
0.25
0.20
0.17
0.85
0.65
1.05
0.15
0.013
0.006
0.004
0.003
0.030
0.022
0.037
0.002
MIN
INCHES
STYLE 2:
NOM
0.015
0.008
0.006
0.005
0.031
0.024
0.014
0.039
0.004
PIN 1. ANODE
2. N/C
3. CATHODE
MAX
0.016
0.010
0.008
0.007
0.033
0.026
0.041
0.006
NSD914F3/D

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