STPS1L60 STMicroelectronics, STPS1L60 Datasheet - Page 4

• Manufacturer Part Number: STPS1L60
• Description: DIODE SCHOTTKY LDO 1A 60V DO-41
• Manufacturer: STMicroelectronics

Specifications of STPS1L60

• Voltage - Forward (vf) (max) @ If: 570mV @ 1A
• Voltage - Dc Reverse (vr) (max): 60V
• Current - Average Rectified (io): 1A
• Current - Reverse Leakage @ Vr: 50µA @ 60V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO-41, Axial
• Product: Schottky Rectifiers
• Peak Reverse Voltage: 60 V
• Forward Continuous Current: 1 A
• Max Surge Current: 40 A
• Configuration: Single
• Forward Voltage Drop: 0.75 V at 2 A
• Maximum Reverse Leakage Current: 50 uA
• Operating Temperature Range: + 150 C
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Details

Characteristics
4/10
Figure 7.
Figure 9.
Figure 11. Relative variation of thermal
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-04
18
16
14
12
10
7
6
5
4
3
2
1
0
1.E-04
1.E-02
8
6
4
2
0
I M (A)
Z th(j-a) /R th(j-a)
I M (A)
I M
I M
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
δ = 0.5
δ = 0.5
Single pulse
t
1.E-01
t
Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMA)
Non repetitive surge peak forward
current versus overload duration
(maximum values) (STmite flat)
impedance junction to ambient
versus pulse duration (DO-41)
1.E-03
1.E-03
1.E+00
1.E-02
1.E-02
t(s)
t(s)
1.E+01
1.E-01
1.E-01
1.E+02
STmite flat
T a = 125 °C
T c = 125 °C
T a = 25 °C
T a = 75 °C
T c = 25 °C
T c = 75 °C
SMA
DO-41
t p (s)
Doc ID 7504 Rev 8
1.E+00
1.E+00
1.E+03
Figure 8.
Figure 10. Relative variation of thermal
Figure 12. Relative variation of thermal
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-04
8
7
6
5
4
3
2
1
0
1.E-02
1.E-02
I M (A)
Z th(j-a) /R th(j-a)
Z th(j-a) /R th(j-a)
I M
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
Single pulse
δ = 0.5
Single pulse
1.E-01
1.E-01
t
Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-41)
impedance junction to ambient
versus pulse duration (SMA)
impedance junction to ambient
versus pulse duration (STmite flat)
1.E-03
1.E+00
1.E+00
1.E-02
t(s)
1.E+01
1.E+01
1.E-01
1.E+02
1.E+02
STmite flat
T a = 25 °C
T a = 125 °C
T a = 75 °C
STPS1L60
DO-41
SMA
t p (s)
t p (s)
1.E+00
1.E+03
1.E+03