MR756RL ON Semiconductor, MR756RL Datasheet - Page 4

• Manufacturer Part Number: MR756RL
• Description: DIODE STD REC 6A 600V AXIAL
• Manufacturer: ON Semiconductor

Specifications of MR756RL

• Voltage - Forward (vf) (max) @ If: 900mV @ 6A
• Voltage - Dc Reverse (vr) (max): 600V
• Current - Average Rectified (io): 6A
• Current - Reverse Leakage @ Vr: 25µA @ 600V
• Diode Type: Standard
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Mounting Type: Through Hole
• Package / Case: Axial
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Other names: MR756RLOSTR

8.0
4.0
8.0
4.0
32
28
24
20
16
12
28
24
20
16
12
0
5.0
0
40
35
30
25
20
15
10
0
0
0
0
CAPACITANCE LOADS
L = 1/8"
Figure 8. Steady State Thermal Resistance
SINGLE LEAD TO HEAT SINK,
INSIGNIFICANT HEAT FLOW
THROUGH OTHER LEAD
20
4.0
1/8
1/4"
Figure 5. Maximum Current Ratings
I
F(AV)
3/8"
40
I
(pk)
Figure 7. Power Dissipation
8.0
, AVERAGE FORWARD CURRENT (AMPS)
1/4
10 I
20 I
= 5 I
T
5/8"
60
L
, LEAD TEMPERATURE (°C)
avg
avg
avg
L, LEAD LENGTH (INCHES)
12
3/8
80
100
RESISTIVE − INDUCTIVE LOADS
16
1/2
BOTH LEADS TO HEAT
SINK, EQUAL LENGTH
120
20
5/8
RESISTIVE INDUCTIVE
BOTH LEADS TO HEAT
SINK WITH LENGTHS
AS SHOWN
140
24
3/4
LOADS
160
1F & 3F
28
http://onsemi.com
MR750 SERIES
6F
7/8
180
200
32
1.0
4
7.0
6.0
5.0
4.0
3.0
2.0
1.0
any mounting configuration to be found. Lowest values occur when one
side of the rectifier is brought as close as possible to the heat sink as
shown below. Terms in the model signify:
T
T
R
R
R
P
(Subscripts A and K refer to anode and cathode sides, respectively.)
Values for thermal resistance components are:
R
R
approximately equal to junction temperature in practical lead mounted
applications. When used as a 60 Hz rectifierm the slow thermal response
holds T
be found from: T
sketch, where R
surface area. Values of 40°C/W are typical for mounting to terminal strips
or P.C. boards where available surface area is small.
0
A
L
F
qS
qL
qJ
qL
qJ
Use of the above model permits junction to lead thermal resistance for
Since R
The recommended method of mounting to a P.C. board is shown on the
T
= Ambient Temperature
= Lead Temperature
R
= Power Dissipation
0
A(A)
É É
É É É É
É É É É
É É
É É É É
= 2°C/W typically and 4°C/W Maximum.
= Thermal Resistance, Lead to Heat Sink
= Thermal Resistance, Junction to Case
= 40°C/W/in. Typically and 44°C/W/in Maximum.
qS(A)
= Thermal Resistance, Heat Sink to Ambient
J(PK)
R
T
qJ
20
Recommended mounting for half wave circuit
L(A)
qJA
is so low, measurements of the case temperature, T
close to T
SEE NOTE
Figure 6. Maximum Current Ratings
= 40°C/W
R
(For Heat Conduction Through The Leads)
qJA
40
qL(A)
L
= 175°−R
THERMAL CIRCUIT MODEL
Board Ground Plane
is approximately 25°C/W for a 1−1/2" x 1−1/2" copper
T
6F (I
A
J(AVG)
T
, AMBIENT TEMPERATURE (°C)
60
C(A)
PK
R
qJL
. Therefore maximum lead temperature may
qJ(A)
/I
R
AVE
80
qJA
P
NOTES
T
F
J
SEE NOTE
. P
= 6.28)
= 25°C/W
T
T
F
CAPACITANCE LOADS − 1F & 3F
100
C
J
RESISTIVE INDUCTIVE LOADS
may be found from Figure 7.
P
= Junction Temperature
R
= Case Temperature
F
qJ(K)
120
T
C(K)
140
R
qL(K)
160
f = 60 Hz
I
I
I
(pk)
(pk)
(pk)
T
L(K)
= 5 I
= 10 I
= 20 I
C
R
T
180
, will be
qS(K)
A(K)
avg
avg
avg
200