MURS360BT3G ON Semiconductor, MURS360BT3G Datasheet
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MURS360BT3G
Specifications of MURS360BT3G
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MURS360BT3G Summary of contents
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... G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping MURS360BT3G SMB 2500/Tape & Reel (Pb-Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ...
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THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction-to-Lead (Note 1) Thermal Resistance, Junction-to-Ambient (Note 1) 1. Mounted with minimum recommended pad size, PC Board FR4. ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 3 25°C) F ...
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V , REVERSE VOLTAGE (V) r Figure 5. Typical Capacitance 3 R qJA R qJA dc No Heatsink Square Wave ...
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Duty Cycle 20% 10 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 Figure 10. Thermal Response, Junction-to-Ambient MURS360BT3 0.001 0.01 0.1 PULSE TIME (s) http://onsemi.com 100 1000 ...
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... Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...