1612507-3 TE Connectivity, 1612507-3 Datasheet
1612507-3
Manufacturer Part Number
1612507-3
Description
HARD TRAY ASS'Y DDR SODIMM SOC
Manufacturer
TE Connectivity
Datasheet
1.1612507-3.pdf
(1 pages)
Specifications of 1612507-3
Rohs Compliant
YES
Socket Style
SO DIMM
Dram Type
Double Data Rate (DDR)
Pcb Mount Style
Surface Mount
Module Orientation
Right Angle
Pcb Mount Retention
With
Profile
Standard
Keying
Standard
Dram Voltage
2.5 V
Solder Tail Contact Plating
Gold Flash
Socket Type
Memory Card
Number Of Positions
200
Row-to-row Spacing (mm [in])
6.20 [0.244]
Centerline (mm [in])
0.60 [0.024]
Number Of Rows
Dual
Ejector Type
Locking
Ejector Location
Both Ends
Number Of Keys
1
Pcb Mount Retention Type
Solder Tail (Pin)
Latch Material
Stainless Steel
Latch Plating
Tin
Boss
With
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Gold Flash
Contact Base Material
Copper Alloy
Retention Post Material
Copper Alloy
Housing Material
High Temperature Thermoplastic
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Stack Height (mm [in])
5.20 [0.205]
Insertion Style
Cam-In
Center Key (mm [in])
None
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Rohs/elv Compliance History
Always was RoHS compliant
Application Type
DDR SDRAM
Packaging Method
Hard Tray
Packaging Quantity
16
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
1612507-3
Manufacturer:
TYCO
Quantity:
36 810
Home
Product Details for 1612507
Documentation & Additional Information
Product Drawings:
Catalog Pages/Data Sheets:
Product Specifications:
Application Specifications:
Instruction Sheets:
CAD Files:
Product Features
Product Type Features:
Mechanical Attachment:
Electrical Characteristics:
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Contact Related Features:
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1612507
Products
DDR SODIMM SOCKET 200P STANDARD PROFILE STANDARD
TYPE
None Available
DDR S.O.DIMM Socket 200 Positions
None Available
None Available
None Available
Product Type
Number of Positions
DRAM Type
Module Orientation
PCB Retention Feature = With
PCB Retention Method Feature = Solder Pin
Profile = Standard
Comment = Solder peg plating is tin.
Keying = Standard
DRAM Voltage
Row - to - Row Spacing (mm [in])
Centerline (mm [in])
Number of Rows
Ejector Type = Locking
Ejector Location
Number of Keys
Latch Material = Stainless Steel
Latch Plating = Tin
Boss = With
Contact Mating Area Plating = Gold Flash over
Nickel
Contact Mount
Contact Material = Copper Alloy
Contact Termination Area Plating = Gold Flash
Retention Post Material = Copper Alloy
Documentation
Active
(PDF, English)
Languages
>
By Type
- 3
= Double Data Rate (DDR)
= SO DIMM
(Please use the Product Drawing for all design activity)
>
: English |
= 2.5 V
= Surface Mount
Sockets/Memory Card Products
= 1
= Both Ends
= Dual
Resources
Home
= Right Angle
Memory Sockets
= 200
= 0.60 [0.024]
Product Highlights:
Deutsch
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RoHS Compliant (Statement of Compliance)
Gold Flash over Nickel Contact Mating
Area Plating
SO DIMM
Number of Positions = 200
DRAM Type = Double Data Rate
(DDR)
DRAM Voltage = 2.5 V
View all Features
Customer Support
|
©
- 3
Español
My Account
2006 Tyco Electronics Corporation All Rights Reserved
= 6.20 [0.244]
|
Português (do Brasil)
(PDF, Japanese)
Country Sites
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>
Supplier
Product Feature Selector
Customer Support
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Site Map
:
China
Housing Related Features:
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Privacy Policy
Japan
Housing Material = High Temperature
Thermoplastic
Housing Flammability Rating = UL 94V
Housing Color = Black
Stack Height (mm [in]) = 5.20 [0.205]
Insertion Style
Center Key (mm [in])
RoHS/ELV Compliance
compliant
Lead Free Solder Processes
capable to 245°C
RoHS/ELV Compliance History = Always was
RoHS compliant
Application Type = DDR SDRAM
Packaging Method = Hard Tray
Packaging Quantity = 16
Brand = AMP
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