FDN336P Fairchild Semiconductor, FDN336P Datasheet

MOSFET P-CH 20V 1.3A SSOT3

FDN336P

Manufacturer Part Number
FDN336P
Description
MOSFET P-CH 20V 1.3A SSOT3
Manufacturer
Fairchild Semiconductor
Series
PowerTrench®r
Datasheet

Specifications of FDN336P

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
200 mOhm @ 1.3A, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
1.3A
Vgs(th) (max) @ Id
1.5V @ 250µA
Gate Charge (qg) @ Vgs
5nC @ 4.5V
Input Capacitance (ciss) @ Vds
330pF @ 10V
Power - Max
460mW
Mounting Type
Surface Mount
Package / Case
3-SSOT, SuperSOT-3
Configuration
Single
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.2 Ohm @ 4.5 V
Forward Transconductance Gfs (max / Min)
4 S
Drain-source Breakdown Voltage
20 V
Gate-source Breakdown Voltage
+/- 8 V
Continuous Drain Current
1.3 A
Power Dissipation
500 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FDN336PTR

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This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence. This is a preliminary
notification. A Final PCN will be issued when qualification is complete and data is available.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Ursal, Randy
E-mail: Randy.Ursal@notes.fairchildsemi.com
Phone:
Implementation of change:
Expected 1st Device Shipment Date: 2008/01/14
Earliest Year/Work Week of Changed Product: D0803
Change Type Description: Mold Compound
Description of Change (From): SSOT-3 and SSOT-6 package assembly in FSC approved
manufacturing locations using non-Green mold compound as shown in table 1:
Description of Change (To): SSOT-3 and SSOT-6 package assembly at all FSC approved
manufacturing locations using Green mold compound as shown in table 2:
Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is
dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level
interconnect lead-free and RoHS compliance. The referenced material changes have been made
to provide a "Full Green" (Halogen Free Flame Retardant) package. For additional details on the
corporate wide green initiative please visit our Web site at:
http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same
assembly facilities producing the current non-green products. Package outline drawings of the
affected products remain un-changed. Green products will be fully compliant to all published
data sheet specifications and will be interchangeable with current non-green product. Quality
and reliability will remain at the highest standards already demonstrated with Fairchild's
existing products.
Qual/REL Plan Numbers : Q20070473
Qualification :
Qualification of Green Molding compound for SSOT-3 and SSOT-6.
Change From
Technical Contact:
Name: Uy, Lester
E-mail: Lester.Uy@fairchildsemi.com
Phone: 63-32-3415636
FORECAST CHANGE NOTIFICATION
Date Issued On : 2007/12/07
Date Created : 2007/11/29
PCN# : Q4074811
Pg. 1

Related parts for FDN336P

FDN336P Summary of contents

Page 1

... This notification is for your information and concurrence. This is a preliminary notification. A Final PCN will be issued when qualification is complete and data is available. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. If you have any questions concerning this change, please contact: ...

Page 2

Change To Pg. 2 ...

Page 3

Qualification Stress Test and Sample Size Detail Device #1 FAN2558SX Package: TTG23 #Leads: 006 Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard ACLV X JESD22-A102 100%RH, 121C 96 SOPL1 JESD22-A108 NA%RH, 150C THBT X JESD22-A101 ...

Page 4

Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard ACLV X JESD22-A102 100%RH, 121C 96 PRCL MIL- STD-750-1036 TMCL1 X JESD22-A104 -65C, 150C Device #3 FDC637BNZ Package: TTK23 006 #Leads: Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment ...

Page 5

Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard ACLV X JESD22-A102 100%RH, 121C 96 H3TRB X JESD22-A101B85%RH, 85C, HAST2 X JESD22-A110 85%RH, 110C, HTGB JESD22-A108 150C, 25V HTRB JESD22-A108 150C, 24V PRCL MIL- STD-750-1036 TMCL1 ...

Page 6

... MIL- STD-750-1036 TMCL1 X JESD22-A104 -65C, 150C UHAST1 X JESD22-A118 100%RH, 121C 96 Product Id Description : This forecast notification covers Fairchild Semiconductor SSOT-3 & SSOT-6 packages. For complete listing of products covered in this PCN release, please refer to the Affected FSID listing. Affected FSIDs : 0332_B03005A FAN2559S13X FDC2512 ...

Page 7

... FDC642P_F095 FDC6432SH FDC645N_F095 FDC6506P_NB4S006A FDC653N_F073 FDC653N_NL FDC654P_F095 FDC654P_NF073 FDC655AN_F095 FDC655BN_F073 FDC655N_NB5E016B FDC6561AN_NL FDC658P FDC658P_NB4E011 FDC6901L FDN302P FDN304PZ FDN304P_NL FDN308P FDN335N FDN336P_NL FDN338P FDN3400 FDN340P_NL FDN352AP FDN357N FDN358P_NL FDN359BN FDN360P_NL FDN361BN FDN5618P FDN5630 FMB100 FMB2227A FMB3906 FMB5551 FMBA14 FMBM5401_SB74001 FMBS5401 FMBSA06 FMMT549 ...

Page 8

NDC7002N_SB9G007 NDS331N_D87Z NDS332P NDS335N NDS336P NDS351AN_NL NDS352AP NDS355AN_NB9L007A NDS356AP PB32_BPB003A SI3442DV_NL SI3454DV_F073 SI3456DV_NF073 SI3457DV_F073 NDC7003P NDS331N_ND87Z NDS332P_F080 NDS335N_D87Z NDS336P_NL NDS351AN_SBNL001 NDS352AP_NL NDS355AN_NL NDS356AP_NB8L005A SI3442DV_F073 SI3443DV SI3455DV_F073 SI3456DV_NL SI3457DV_F095 NDS331N NDS331N_NL NDS332P_NL NDS335N_NL NDS351AN NDS351N NDS355AN NDS355N NDS356AP_NL SI3442DV_NF073 SI3443DV_F095 SI3456DV_F073 ...

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