TDA7479D STMicroelectronics, TDA7479D Datasheet - Page 9

• Manufacturer Part Number: TDA7479D
• Description: Audio DSPs Chip RDS Demodulator
• Manufacturer: STMicroelectronics

Specifications of TDA7479D

• Mounting Style: SMD/SMT
• Package / Case: SO-16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TDA7479
5
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK
packages. ECOPACK
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 4.
(1) “D” dimension does not include mold flash, protusions or gate
DIM.
D
ddd
A1
A
B
C
E
H
e
h
L
k
(1)
burrs. Mold flash, protusions or gate burrs shall not exceed
0.15mm per side.
SO16 mechanical data and package dimensions
10.10
MIN.
2.35
0.10
0.33
0.23
7.40
10.0
0.25
0.40
TYP.
1.27
mm
®
0˚ (min.), 8˚ (max.)
packages are lead-free. The category of second Level Interconnect
MAX.
10.50
10.65
2.65
0.30
0.51
0.32
7.60
0.75
1.27
0.10
0.093
0.004
0.013
0.009
0.398
0.291
0.394
0.010
0.016
MIN.
0.050
TYP.
inch
MAX.
0.104
0.012
0.200
0.013
0.413
0.299
0.419
0.030
0.050
0.004
MECHANICAL DATA
SO16 (Wide)
OUTLINE AND
Package information
0016021 C
9/12
®