MC100LVEP111FA ON Semiconductor, MC100LVEP111FA Datasheet - Page 13

Clock Drivers & Distribution 2.5V/3.3V 1:10 Diff

MC100LVEP111FA

Manufacturer Part Number
MC100LVEP111FA
Description
Clock Drivers & Distribution 2.5V/3.3V 1:10 Diff
Manufacturer
ON Semiconductor
Type
ECL, HSTL, PECLr
Datasheet

Specifications of MC100LVEP111FA

Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Multiply / Divide Factor
2:1
Number Of Clock Inputs
2
Output Logic Level
ECL, PECL
Supply Voltage (max)
+/- 3.8 V
Supply Voltage (min)
+/- 2.375 V
Maximum Operating Temperature
+ 85 C
Package / Case
LQFP-32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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0
PUBLICATION ORDERING INFORMATION
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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32 X
2 X
2 X
LOCATION
0.15 C
0.10 C
0.08 C
PIN ONE
0.15 C
32 X
L
32 X
0.10
0.05 C
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
É É
É É
8
1
C
BOTTOM VIEW
32
9
A
SIDE VIEW
TOP VIEW
B
D2
D
16
25
A1
17
(A3)
24
e
E
EXPOSED PAD
E2
A
B
32 X
K
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
A
QFN32 5*5*1 0.5 P
http://onsemi.com
CASE 488AM−01
C
SEATING
PLANE
ISSUE O
*For additional information on our Pb−Free strategy and soldering
13
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.63
32 X
0.28
32 X
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONS AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM TERMINAL
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
D2
E2
A
b
D
E
K
L
e
3.20
5.30
0.800
0.000
0.180
2.950
2.950
0.200
0.300
MIN
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MILLIMETERS
0.500 BSC
0.200 REF
5.00 BSC
5.00 BSC
DIMENSIONS: MILLIMETERS
NOM
0.900
0.025
0.250
3.100
3.100
0.400
−−−
1.000
0.050
0.300
3.250
3.250
0.500
MAX
−−−
0.50 PITCH
28 X
3.20
MC100LVEP111/D
5.30

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