DS1744WP-120IND Maxim Integrated Products, DS1744WP-120IND Datasheet - Page 15

• Manufacturer Part Number: DS1744WP-120IND
• Description: Real Time Clock
• Manufacturer: Maxim Integrated Products

Specifications of DS1744WP-120IND

• Function: Clock, Calendar, NV Timekeeping RAM
• Rtc Memory Size: 32768 B
• Supply Voltage (max): 3.63 V
• Supply Voltage (min): 2.97 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Rtc Bus Interface: Parallel
• Package / Case: PowerCap
• Time Format: HH:MM:SS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AC TEST CONDITIONS
Output Load: 50pF + 1TTL Gate
Input Pulse Levels: 0 to 3.0V
Timing Measurement Reference Levels:
Input Pulse Rise and Fall Times: 5ns
NOTES:
1) Voltages are referenced to ground.
2) Typical values are at +25C and nominal supplies.
3) Outputs are open.
4) Battery switchover occurs at the lower of either the battery terminal voltage or V
5) Data-retention time is at +25C.
6) Each DS1744 has a built-in switch that disconnects the lithium source until the user first applies V
7) RTC modules (DIP) can be successfully processed through conventional wave-soldering techniques as
8) t
9) t
10) t
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE
The expected t
in the absence of V
long as temperature exposure to the lithium energy source contained within does not exceed +85C.
Post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic vibration is
not used.
In addition, for the PowerCap:
AH1
AH2
WC
34 PWRCP
Input: 1.5V
Output: 1.5V
a. ) Maxim recommends that PowerCap module bases experience one pass through solder reflow
b.) Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than 3
, t
, t
= 200ns.
28 EDIP
DH1
DH2
oriented with the label side up (“live-bug”).
seconds. To solder, apply flux to the pad, heat the lead frame pad, and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows, and use a solder wick to
remove solder.
are measured from WE going high.
are measured from CE going high.
DR
is defined for DIP modules and assembled PowerCap modules as a cumulative time
CC
starting from the time power is first applied by the user.
PACKAGE CODE
MDF28+3
PC2+2
DS1744/DS1744P Y2K-Compliant, Nonvolatile Timekeeping RAMs
15 of 16
DOCUMENT NO.
21-0245
21-0246
LAND PATTERN NO.
Note that a “+”, “#”, or “-”
PF
.
—
—
CC
.