MC100LVEP210FA ON Semiconductor, MC100LVEP210FA Datasheet - Page 8
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MC100LVEP210FA
Manufacturer Part Number
MC100LVEP210FA
Description
Clock Buffer 2.5V/3.3V 1:5 Dual
Manufacturer
ON Semiconductor
Datasheet
1.MC100LVEP210FAR2.pdf
(9 pages)
Specifications of MC100LVEP210FA
Number Of Outputs
20
Max Input Freq
3000 MHz
Propagation Delay (max)
0.43 ns
Supply Voltage (max)
+/- 3.8 V
Supply Voltage (min)
+/- 2.375 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Package / Case
LQFP-32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC100LVEP210FAG
Manufacturer:
ON Semiconductor
Quantity:
10 000
Part Number:
MC100LVEP210FAG
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
MC100LVEP210FAR2
Manufacturer:
ON
Quantity:
20 000
Company:
Part Number:
MC100LVEP210FARG
Manufacturer:
ON Semiconductor
Quantity:
1 050
Company:
Part Number:
MC100LVEP210FARG
Manufacturer:
ON Semiconductor
Quantity:
10 000
Part Number:
MC100LVEP210FARG
Manufacturer:
ON/安森美
Quantity:
20 000
SEATING
PLANE
9
B
-AB-
-AC-
B1
-T-
8
1
32
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
NOTES:
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION:
3. DATUM PLANE -AB- IS LOCATED AT
4. DATUMS -T-, -U-, AND -Z- TO BE
5. DIMENSIONS S AND V TO BE
6. DIMENSIONS A AND B DO NOT INCLUDE
7. DIMENSION D DOES NOT INCLUDE
8. MINIMUM SOLDER PLATE THICKNESS
9. EXACT SHAPE OF EACH CORNER MAY
PER ANSI Y14.5M, 1982.
MILLIMETER.
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DETERMINED AT DATUM PLANE -AB-.
DETERMINED AT SEATING PLANE -AC-.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -AB-.
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
SHALL BE 0.0076 (0.0003).
VARY FROM DEPICTION.
-Z-
25
4X
17
4X
0.20 (0.008)
-U-
0.20 (0.008)
V1
PACKAGE DIMENSIONS
DETAIL AD
V
MC100LVEP210
http://onsemi.com
AB
32 LEAD LQFP
CASE 873A-02
AC
T-U
ISSUE C
T-U
8
Z
C
Z
E
P
H
DIM
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
V
X
F
J
1.400
0.300
1.350
0.300
0.050
0.090
0.450
0.090
0.150
8X
MILLIMETERS
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
1
12 REF
_
M_
_
DETAIL AD
W
1.600
0.450
1.450
0.400
0.150
0.200
0.750
0.160
0.250
MAX
5
DETAIL Y
_
0.055
0.012
0.053
0.012
0.002
0.004
0.018
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
1
12 REF
INCHES
_
_
MAX
0.063
0.018
0.057
0.016
0.006
0.008
0.030
0.006
0.010
X
5
_
AE
AE
K
R
Q_
SECTION AE-AE
É É
É É É É
É É
F
METAL
BASE
J
N
D