DS12CR887-33 Maxim Integrated Products, DS12CR887-33 Datasheet - Page 6
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DS12CR887-33
Manufacturer Part Number
DS12CR887-33
Description
Real Time Clock
Manufacturer
Maxim Integrated Products
Datasheet
1.DS12885N.pdf
(22 pages)
Specifications of DS12CR887-33
Function
Clock, Calendar
Rtc Memory Size
114 B
Supply Voltage (max)
3.63 V
Supply Voltage (min)
2.97 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Rtc Bus Interface
Multiplexed
Package / Case
eDIP
Time Format
HH:MM:SS, Binary
Date Format
DW:DM:M:Y, Binary
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DS12CR887-33+
Manufacturer:
MAXIM/美信
Quantity:
20 000
Real-Time Clocks
POWER-UP/POWER-DOWN CHARACTERISTICS
(T
DATA RETENTION
(T
CAPACITANCE
(T
AC TEST CONDITIONS
WARNING:
6
Note 1: RTC modules can be successfully processed through conventional wave-soldering techniques as long as temperature
Note 2: Limits at -40°C are guaranteed by design and not production tested.
Note 3: All voltages are referenced to ground.
Note 4: All outputs are open.
Note 5: Specified with CS = DS = R/W = RESET = V
Note 6: Applies to the AD0 to AD7 pins, the IRQ pin, and the SQW pin when each is in a high-impedance state.
Note 7: The MOT pin has an internal 20kΩ pulldown.
Note 8: Measured with a 32.768kHz crystal attached to X1 and X2.
Note 9: Guaranteed by design. Not production tested.
Note 10: Measured with a 50pF capacitance load.
Input Pulse Levels
Output Load Including Scope and Jig
Input and Output Timing Measurement Reference Levels
Input-Pulse Rise and Fall Times
Recovery at Power-Up
V
V
V
V
Expected Data Retention
Capacitance on All Input Pins
Except X1 and X2
Capacitance on IRQ, SQW, and
DQ Pins
A
A
A
CC
PF(MIN)
CC
PF(MAX)
= -40°C to +85°C) (Note 2)
= +25°C)
= +25°C) (Note 9)
_____________________________________________________________________
Fall Time; V
Rise Time; V
exposure to the lithium energy source contained within does not exceed +85°C. However, post-solder cleaning with water-
washing techniques is acceptable, provided that ultrasonic vibrations are not used to prevent crystal damage.
PARAMETER
PARAMETER
PARAMETER
PF(MAX)
Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data.
PF(MIN)
to
to
PARAMETER
SYMBOL
SYMBOL
SYMBOL
t
C
C
RPU
t
t
t
DR
F
R
IN
IO
CC
; MOT, AS, AD0–AD7 = 0; V
CONDITIONS
CONDITIONS
CONDITIONS
0 to 3.0V
50pF + 1TTL Gate
Input/Output: V
5ns
IL
maximum and V
BACKUP
TEST CONDITIONS
open.
MIN
MIN
MIN
300
20
10
0
IH
minimum
TYP
TYP
TYP
MAX
MAX
MAX
200
5
7
UNITS
UNITS
UNITS
years
ms
pF
pF
µs
µs