MC10EL32DT ON Semiconductor, MC10EL32DT Datasheet - Page 5

Clock Drivers & Distribution 5V ECL Divide By 2

MC10EL32DT

Manufacturer Part Number
MC10EL32DT
Description
Clock Drivers & Distribution 5V ECL Divide By 2
Manufacturer
ON Semiconductor
Datasheet

Specifications of MC10EL32DT

Mounting Style
SMD/SMT
Package / Case
TSSOP-8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Manufacturer
Quantity
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Manufacturer:
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Table 7. AC CHARACTERISTICS
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
14. 10 Series: V
15. V
f
t
t
V
t
t
t
Symbol
max
PLH
PHL
JITTER
r
f
PP
100 Series: V
PP
(min) is minimum input swing for which AC parameters guaranteed. The device has a DC gain of ≈40.
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Maximum Toggle Frequency
Propagation Delay
Input Swing (Note 15)
Cycle−to−Cycle Jitter
Output Rise/Fall Times Q
EE
EE
RESET
can vary +0.25 V / −0.5 V.
can vary +0.8 V / −0.5 V.
(20% − 80%)
CLK
Q
Characteristic
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Driver
Device
Figure 3. Typical Termination for Output Driver and Device Evaluation
V
Reset to Q
CC
Q
Q
CLK to Q
= 5.0 V; V
Figure 2. Timing Diagram
EE
Min
360
390
150
100
2.2
= 0 V or V
Z
Z
http://onsemi.com
o
o
= 50 W
= 50 W
−40°C
TBD
Typ
500
540
225
3.0
CC
50 W
V
5
TT
= 0 V; V
= V
1000
Max
640
690
350
V
CC
TT
EE
− 2.0 V
50 W
= −5.0 V (Note 14)
Min
420
440
150
100
2.6
25°C
TBD
Typ
510
540
225
3.0
D
D
1000
Max
600
640
350
Receiver
Device
Min
450
450
150
100
2.6
85°C
TBD
Typ
540
550
225
3.0
1000
Max
630
650
350
GHz
Unit
mV
ps
ps
ps

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